CITC - Chip Integration Technology Center

Last Friday, our colleague Henry Antony Martin gave a guest lecture at Delft University of Technology. Within the course Microelectronics Reliability he talked to 15 students about reliability challenges and assessment methods in electronics packaging. Henry's guest lecture is part of our many educational activities. CITC strongly supports the education of the new generation of semiconductor researchers. #accesstoeducation #accesstoinnovation #semiconductorpackaging #reliabilitychallenges

Hora est! Yesterday, our colleague Henry Antony Martin successfully presented and defended his thesis 'Prognostics and Thermal Management of Power Electronic Packages' at Delft University of Technology. He was awarded the degree of doctor, making him the first CITC PhD candidate to achieve this. We are very proud of him and hope he is the first of many to follow. Congratulations dr. ir. Henry! #accesstoeducation #phd #chippackaging

It was great fun to participate in the regio Nijmegen On Stage Career Festival last Tuesday. About 1,000 students got the chance to explore future professions and CITC was there to promote the job of researcher. We fully support the central theme of the festival: 'You may become anything... except unhappy - promise?' and hope that the 13/14-year olds present will choose a career in #STEM. Special thanks to Noud Schoenmakers and Rianne V. for your work!

Vacancy alert! We have a job opening for an R&D Scientist in Advanced Semiconductor Packaging. If you recognize yourself or someone you recommend in the description below, please feel free to contact us. Our new colleague will be at the forefront of developing next-generation high-performance chip packaging solutions for applications such as automotive radar, photonics, and power electronics. Your expertise will contribute to CITC’s fan-out packaging platform, leveraging deep knowledge in large-area processing, thin-film electronics, and additive manufacturing. You will be involved in designing, fabricating, and characterizing advanced semiconductor packages, collaborating with leading industry partners and multidisciplinary experts. A key aspect of your role is to translate industry needs into innovative technology solutions, ensuring scalability, reliability, and manufacturability. Please note: the recruitment process is managed by our partner TNO, so check out the full job description and apply on their website. You can apply until March 26, 2025. https://lnkd.in/eh7ZVEtB #jobopening #semiconductorpackaging #RandD

Internship alert! We have a master thesis project for MSc students in either Mechanical Engineering or Electrical Engineering. There is an industrial interest to lower the costs of current manufacturing processes for printed SMD components. Through printing, resistive elements can be produced but the challenge remains with bumping. Replacing expensive metallization processes with printed copper pillars can potentially reduce product costs, processing steps, and facilitates flip-chip bonding. Copper sintered pillars favor soldering unlike silver which suffers from diffusion of solders. Your assignment consists of an investigation of different processes for printing different sizes of copper pillars that are compatible with various SMD codes. You can find more details about the assignment and the supervisors below: https://lnkd.in/eQMQvmy5 #internship #masterthesisproject #mechanicalengineering #electricalengineering

Sander Dorrestein is one of the speakers at next week's Optica Online Industry Meeting on PIC Packaging for Volume Production. The meeting will focus on challenges in PIC assembly, such as precision alignment, thermal management, and co-packaging with electronic components. Join Sander and other speakers from e.g. Tyndall National Institute, PHIX Photonics Assembly, vario-optics and Finetech on February 25. Register via the website below: https://lnkd.in/gtuhj6V5

On Monday, we welcomed a new intern: Alex Harper. A familiar face, because Alex was one of the participants of this year’s Semiconductor Packaging minor and already did the practical work of this minor at CITC. In the coming months, he will be working on slit nozzle dispensing. His assignment focuses on the design of the nozzle and process research. A little background on this: current slit nozzles that are commercially available are relatively expensive and have a long lead time of 2-3 months. CITC worked on an alternative design (patent pending) which differs from other nozzles in that the design is flexible. Iterations in both dispense volume and shapes are easy to make. Production is done with 3D printing, which is cheap and makes the nozzles disposable. Alex will work on improvements to the current design and define process parameters – one cannot exist without the other. Welcome Alex and good luck with your assignment! #accesstoeducation #slitnozzledispensing #semiconductorpackaging

Pleased with this milestone for our PhD candidate Noud Schoenmakers: his first publication is out! If you want to learn more about the complex interplay between the microstructures of sintered silver interconnects, their failure mechanisms, and the resulting interface fracture toughness, check out his article in 'Engineering Fracture Mechanics'. Well done, Noud, On to the next article! #accesstoeducation #failremechanisms

Today is the International Day of Women and Girls in Science. That makes us pause for a moment to think of the ladies of CITC who are holding their own every day in a world dominated by men. At CITC, 50% of our researchers are women and we are proud of that! We hope that these ladies are an example for all those girls - everywhere in the world - who aspire to a career in science and just need that little push to go for it. #justdoit

On Friday, we had a visit from Member of Parliament Joris Thijssen. After a visit to Nexperia and ITEC , CITC was part of his working visit to the semiconductor sector in #Lifeport Region Arnhem-Nijmegen. Francesca Chiappini introduced him to the world of chip packaging and explained how innovation in chip packaging contributes to more efficient, sustainable and smarter chips. He also learned about our education activities and the need for trained semiconductor staff in this region, the rest of the Netherlands, and Europe. A special thanks to The Economic Board Regio Arnhem Nijmegen for organizing this visit! #semiconductorpackaging #accesstoinnovation #accesstoinfrastructure #accesstoeducation Jan Van Dellen Sijbrand de Jong 🟥 Hanneline Oosting-Adriaansens Paul Emans Jean-Pierre Kempeneers