Amir Taraghi

Tackling Data Retention in SSDs (by Anil Burra from Intelligent Memory) 🤩 "SSDs have conquered the market due to their speed, durability, energy efficiency, and small form factor. However, write endurance and data retention are concerns in #embedded and #industrial applications, especially as the technology moves to ever smaller nodes." (Anil Burra) With the scaling of #NAND #flash #technology to higher densities (e.g., Triple-Level-Cell or Quad Level-Cell) and smaller process nodes, data retention becomes more challenging due to increased cell-to-cell interference and reduced margins for charge storage. Therefore, newer #technologies may have shorter specified data retention periods compared to older, more robust #SLC (Single-Level-Cell) or #MLC (Mul ti-Level-Cell) #NAND products. Two key factors affect data retention, the period over which #flashmemory can store #data without loss or corruption, in #NANDflash cells: program/erase (P/E) cycling and operating temperature. A very big thank you to Anil Burra from Intelligent Memory for this insightful article via Electronic Specifier Ltd with more background and insights via the link below 💡🙏👇 - A very good read to an important TOPIC 🤩 https://lnkd.in/eqdH7-N2 #semiconductorindustry #semiconductormanufacturing #innovation #it #ai #ssd #datastorage #automotiveindustry #embeddedsystems #ic #computer #computing #iot #memory #chip #chips #technology #tech

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TSMC and Cadence are collaborating on next-generation #AI-driven flows, including the Cadence Cerebrus™ Intelligent Chip Explorer, for design productivity and optimization and Pegasus™ Verification System for Physical verification Signoff. #Cadence #Signoff #PhysicalVerification #Design #FoundryCertified “We have a distinguished track record collaborating with TSMC to deliver a broad set of innovations across EDA, packaging and IP to accelerate system and semiconductor design and enable customers to achieve aggressive time-to-market goals. These new certified design flows and standardized solutions allow customers to confidently design for TSMC advanced nodes and usher in improved design efficiency and technological advancements,” said Chin-Chi Teng, SVP and GM, R&D, Cadence. Read the press release here: https://ow.ly/bTym50REHjG

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Ampere announces 256-core 3nm #CPU, unveils partnership with Qualcomm 💡 Also looking at #chiplets, integration of third-party #IP Ampere Computing introduced its roadmap for the coming years, including new #CPUs and collaborations with third parties. In particular, the company said it would launch its all-new 256-core AmpereOne #processor next year, made on TSMC's N3 process #technology. Also, Ampere is teaming up with Qualcomm to build #AI inference #servers with the company's accelerators. Apparently, Huawei is also looking at integrating third-party UCIe-compatible #chiplets into its own platforms. Ampere has begun shipping 192-core AmpereOne processors with an eight-channel DDR5 memory subsystem it introduced a year ago. Later this year, the company plans to introduce 192-core AmpereOne CPUs with a 12-channel DDR5 memory subsystem, requiring a brand-new platform. Thanks again to Anton Shilov and Tom's Hardware for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/e6kMBR2Q #semiconductorindustry #semiconductors #semiconductor #tech #cpu #it #ic #semiconductormanufacturing #technology #chip #foundry #ai

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TechRadar's John Loeffler says Intel's Battlemage graphics cards "might just be the 1440p budget champions we've been waiting for." Read on for details. #IAmIntel https://bit.ly/3OGLXOA

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If you try to be objective. AMD started with Su and Papermaster. They promised ryzen to be on par with lower tier intel. They kept promising and delivering. It is not rocket science, ppl are accustomed to announcements then delays and then barely matching the amd cpu that is at least 9 months old. To the outside the problem is very clear.

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NY senator breaks a spoiler to AP: Micron Technology to receive $6.1B from the Chips Act. Excerpts from Boise (Idaho) Development : "Micron Technology will get $6.1 billion from the CHIPS Act to fund large-scale expansions in Boise and Syracuse, NY. ... Micron has started work on a $15-billion expansion of its Boise campus, which would add significant new research and development capacity to the site off Federal Way. The City of Boise annexed nearly a square mile of new land for Micron, and work has begun on initial infrastructure. The Boise expansion would add nearly 2,000 local jobs, the company said. ... In addition to the federal funds, Micron will get incentives from the State of Idaho as well as some non-direct assistance from the City of Boise, as BoiseDev previously reported. ... Micron will also build a nearly $100-million facility near Syracuse, New York, which Schumer said to the AP is the largest single investment in that state since the Erie Canal. ... Schumer told Syracuse.com that the deal was preliminary and non-binding and could be announced next week. ... Correction: A prior version of this story incorrectly stated that the reported mount was $5.1 billion. It is $6.1 billion." https://lnkd.in/gCByqhnb

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The end of an era. We wait to see how the story moves forward for a great technology company. The PC and Data Center market needs the scale that Intel brings. Intel Announces Retirement of CEO Pat Gelsinger. David Zinsner and Michelle Johnston Holthaus named interim Co-CEOs. Holthaus also appointed to the newly created position of CEO of Intel Products. Frank Yeary named interim executive chair. SANTA CLARA, Calif., Dec. 2, 2024 – Intel Corporation (NASDAQ: INTC) today announced that CEO Pat Gelsinger retired from the company after a distinguished 40-plus-year career and has stepped down from the board of directors, effective Dec. 1, 2024.  Intel has named two senior leaders, David Zinsner and Michelle (MJ) Johnston Holthaus, as interim co-chief executive officers while the board of directors conducts a search for a new CEO. Zinsner is executive vice president and chief financial officer, and Holthaus has been appointed to the newly created position of CEO of Intel Products, a group that encompasses the company’s Client Computing Group (CCG), Data Center and AI Group (DCAI) and Network and Edge Group (NEX). Frank Yeary, independent chair of the board of Intel, will become interim executive chair during the period of transition. Intel Foundry leadership structure remains unchanged. The board has formed a search committee and will work diligently and expeditiously to find a permanent successor to Gelsinger. Yeary said, “On behalf of the board, I want to thank Pat for his many years of service and dedication to Intel across a long career in technology leadership. Pat spent his formative years at Intel, then returned at a critical time for the company in 2021. As a leader, Pat helped launch and revitalize process manufacturing by investing in state-of-the-art semiconductor manufacturing, while working tirelessly to drive innovation throughout the company.” Yeary continued, “While we have made significant progress in regaining manufacturing competitiveness and building the capabilities to be a world-class foundry, we know that we have much more work to do at the company and are committed to restoring investor confidence. As a board, we know first and foremost that we must put our product group at the center of all we do. Our customers demand this from us, and we will deliver for them. With MJ’s permanent elevation to CEO of Intel Products along with her interim co-CEO role of Intel, we are ensuring the product group will have the resources needed to deliver for our customers. Ultimately, returning to process leadership is central to product leadership, and we will remain focused on that mission while driving greater efficiency and improved profitability.” #intel #nvidia #amd #tsmc #semiconductors #ai #succession #CPU #x86 #chipsact #leadership #innovation

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#HBM4 set to land sooner than expected 💡 Suppliers and JEDEC are bringing their HBM4 plans forward as they suspect the forecasted Gen #AI boom means incoming NVIDIA GPUs will need it sooner. High bandwidth memory (#HBM) bypasses #X86 socket-connected #DRAM capacity and bandwidth limits by having #memory dies stacked on top of a logic layer, with interconnecting TSV channels, all linked to a #GPU via an interposer component providing higher bandwidth than X86 sockets. The Joint Electron Device Engineering Council (JEDEC) confirms and issues HBM standards, with the current one being its fifth, HBM3E (extended). JEDEC has said it will issue a completed HBM4 spec by the end of this year – just few months ago the schedule was for a 2025 delivery. Preliminary HBM4 characteristics are emerging already. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eZp_wyHB #semiconductorindustry #semiconductors #semiconductor #technology #tech #innovation #semiconductormanufacturing #it #chip #chips #ic #it

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🔍It’s no mystery: there's no #AI without #hardware. As AI continues to help solve great mysteries from the ocean to space, here’s one I can help solve: custom chip #tech is mission-critical for the #future of AI. Unpack more insights in #ConnectingAI: https://lnkd.in/gw3jBcuJ #artificialintelligence #machinelearning

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Intel Corporation will now be spinning off it's Intel Foundry division into a wholly owned subsidiary and also consolidating all it's design operations into CCG (client computing group, or lpatop/PC division) and DCAI (datacenters and AI, the server group). Networking group NEX will remain for now, but it is too small now and I'm guessing it will be sold off. Qualcomm is already looking to acquire some of Intel's operations as per The Wall Street Journal; Qualcomm is most likely interested in the CCG piece. (https://lnkd.in/gYkgwxGq) Intel will likely break itself into three major pieces - Manufacturing/Foundry, CCG and DCAI will become separate companies. But let's talk about Intel Foundry : Intel consolidated all it's manufacturing and research into Intel Foundry which started reporting it's own P&L from Q1 of this year. But it wasn't a different legal entity which now Pat Gelsinger has announced will happen. But even then, without a much more massive US govt assistance, Intel can't pay to become competitive again. US govt is the only entity that can pay for, the R&D needed to catch to TSMC and match Samsung Semiconductor, pay for new fabs etc. However Intel's failure to get a customer (Broadcom most recently, and Qualcomm and NVIDIA long ago, dropped the 18A offering) created multiple problems - the US Commerce Department's conditons for funding were not being met. And since AMD never showed any interest, - any help to Intel Foundry, which has been a part of Intel (unlike help to TSMC and even Samsung Semiconductors - both of which have well established fab business and serve multiple customers), would be construe a help to wider Intel business which then competes with AMD, Qualcomm, Nvidia. The latest move to separate out the Foundry as a legal entity opens to path to solve multiple problems at month. In my speculation the following will happen before Q3'2025: (1) Intel Foundry will not only become a separate company (legal entity) as Pat Gelsinger has already announced, it will in fact drop the name "Intel" altogether and be names something like "American National Fab corporation" - National Semiconductor would have been a good name but it is already taken. (2) Intel (or whatever survives without Foundry) will have less than majority stake in the new entity. A consortium made of AMD, Qualcomm, NVIDIA, Texas Instruments, Analog Devices ... all the marquee names of US Semiconductor industry will also be "encouraged" by US Commerce department to aquire, between themselves, a majority stake. Even the likes of TSMC may be persuaded. (3) US Govt will subsequently open the floodgates of money to the foundry to make it a success. (4) The new owners will bring about management and technical ladder changes acutely needed. I hope this happens for the sake of the talented employees, the US and the world public.

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🔝 Strong Quarter for AMD! 📈 AMD CEO Lisa Su shared exciting highlights on CNBC's 'Squawk on the Street': 📈 Record Performance: AMD shares soared, reflecting a strong quarter despite initial market drops. 🤖 AI Revolution: AI technology is a key driver, with AMD Instinct accelerator revenue projections increased to $4.5 billion. 💬 CEO Insights: Lisa Su called AI the biggest tech advancement in the past 50 years. 📊 Revenue Growth: Data Center revenue more than doubled in Q2, with strong growth expected in the second half of the year. 🏆 High Demand: Huge demand for AMD’s compute power across various sectors. Key Points: 🎯 Customer Success: Achieving important milestones and strong partnerships with Microsoft, Meta, Oracle, and OEMs. 💻 AI PCs: AI-powered PCs are game-changers, promising growth into 2025. 📈 Market Position: Confident in capturing market share and driving the AI market, projected to reach $400 billion in 5 years. Lisa Su is optimistic about AI’s potential and AMD’s strategic growth. 👀 Watch the full interview here: https://lnkd.in/gTFR3w8F #AMD #AI #Technology #Growth #Innovation #LisaSu #Datacenter #MarketDemand #Partnerships #Investment

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Great article with insights by Bernard Murphy at SemiWiki.com, "Arteris Frames Network-On-Chip Topologies in the Car." "... while there is plenty of complexity in evolving car architectures and the consequent impact on subsystem chip/chiplet designs, connected on-chip through both coherent and non-coherent networks, the intent behind these systems is quite clear. We just need to start thinking about total car system architecture rather than individual chip functions." #Arteris #NetworkOnChip #Automotive https://bit.ly/3UiKqls

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HBM (High-Bandwidth Memory), which is based on DRAM products, is a crucial building block for data centers. The following article addresses some complex issues in building such products. https://lnkd.in/gSYcAxuN

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SK hynix wins large order for #HBM from Broadcom 💡 US #chip firm set to compete with NVIDIA South Korean memory chip giant SK Hynix has won a large order to supply high-bandwidth memory (HBM) to #Broadcom, TheElec has learned. The US #chip giant will procure the #memory #chips from #SKHynix to install on the #AIcomputing chip of a #BigTech company, sources said. SK Hynix is expected to supply the chip in the second half of next year. Broadcom actively approached the South Korean memory chip giant, the largest #HBM supplier in the world, to procure verified HBMs, the sources also said.SK Hynix will now surely adjust its #DRAM production capacity projection as it now suppliers HBM to both Nvidia and Broadcom. It is currently supplies the majority of HBM used by Nvidia for their AI accelerators. The South Korean firm aimed to expand its 1b DRAM, which is used as the core die in its HBM, production capacity to 140,000 to 150,000 300mm wafers next year. But with the new Broadcom deal, this is expected to increase to 160,000 to 170,000 300mm #wafers. Thanks again to Seonhaeng Lee and TheElec for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/et6E4wxF #semiconductorindustry #semiconductormanufacturing #tech #it #ic #computer #datacenter #computer #computing #hpc #chip #server

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Arm Is Rebuffed by #Intel After Inquiring About Buying Product Unit - Intel’s rapid decline has spurred takeover speculation - Arm is interested in product group, not factory operations Arm Holdings Plc approached Intel Corporation about potentially buying the ailing chipmaker’s product division, only to be told that the business isn’t for sale, according to a person with direct knowledge of the matter. In the high-level inquiry, Arm didn’t express interest in Intel’s #manufacturing operations, said the person, who asked not to be identified because the discussions were private. Intel has two main units: a product group that sells #chips for #personalcomputers, #servers and #networking equipment, and another that operates its factories. Combining with Intel would help Arm’s reach and kick-start a move toward selling more of its own products. The company currently licenses #technology and designs to customers, who then turn them into complete components. Its client list includes the biggest names in #technology, such as Amazon.com Inc., Qualcomm Inc. and Samsung Electronics Co. Thanks again to Ian King and Bloomberg News for the full article with more background and insights via the link below 🙏💡👇 https://lnkd.in/eCDvrC_h #semiconductorindustry #semiconductors #semiconductor #tech #it #chip #chips #innovation #technology #semiconductormanufacturing

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