Darren Sweet

More progress on glass substrates: AMD has been granted a "significant patent"(12080632) for its glass core substrate technology. The patent outlines methods for producing through glass vias using techniques such as laser drilling, wet etching, and magnetic self-assembly, the latter of which is still a developing technology. Another important element of AMD’s design is the redistribution layer, which routes signals and power between chips and external components using high-density interconnections. Unlike the main glass core, these layers will still use organic dielectric materials (build-up films) and copper, but will be built on the glass substrate’s surface.  The patent also describes a novel method for bonding glass substrates together using copper-based bonding rather than traditional solder bumps. This new bonding technique ensures gap-free, reliable connections, and eliminates the need for underfill materials, making it more suitable for stacking multiple substrates.   AMD has plans to integrate glass substrates into its products by 2025-2026. Source: "HuNan Printed Circuit Association of China, Nov 28,2024" in the CCG Daily News.

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It's beyond me why Congress sends billions overseas to friend and foe alike, but does not approve $45 million for printed circuit manufacturing under the Defense Production Act which is less than the total cost of a single substrate factory to produce Ultra High Density Interconnection PCBs. These are the required platforms for the packaging of semiconductors needed for defense, medical and AI applications. The lack of federal support to regenerate and advance this capability leaves the US. primarily dependent on facilities in Asia. Fortunately, TSMC and Amkor are teaming up to provide the complete process from chip to tested package in Arizona. This will help, but not provide adequate service for all the other chip makers investing in the U.S. that will still have to ship most of their ICs back to Asia for packaging. The U.S. needs to provide better incentives to stimulate domestic investment in the supply chain for the domestic production advanced electronic packages. The U.S. Dept. of Defense (DoD) announced an award of $30 million to TTM Technologies to ramp up U.S.-based production of ultra-high density (U-HDI) printed circuit boards (PCBs) at a facility being developed in Syracuse, NY. TTM is expected to invest up to $130 million for the new facility and create an additional 400 “good paying” jobs, bringing the company’s Central New York workforce to 1,000, according to the the office of New York Governor Kathy Hochul. From the IPC: Action Alert! Help IPC Secure U.S. Defense Electronics Funding: IPC is calling on you to take immediate action to support legislation that strengthens U.S. defense electronics manufacturing. As Congress finalizes government funding for Fiscal Year 2025, the Senate’s version includes $45 million for printed circuit board (PCB) manufacturing under the Defense Production Act (DPA) account. However, unless the House follows suit, this funding could drop to zero, leaving the U.S. dependent on non-domestic sources of the PCBs that power all defense electronics.

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The #semiconductor industry is booming, but skilled engineers and technicians remain in short supply. Intel Corporation's innovative new apprenticeship program in Arizona is a fantastic step towards closing this gap. This is a big step forward for our industry, and allows for: 👉 Skills Gap Solution: Traditional methods aren't enough. Apprenticeships provide a win-win for individuals and companies. 👉 Building a Retentive & Diverse Workforce: 90% of apprentices stay with their employers, creating a more stable and inclusive talent pool. 👉 Future-Proofing the Industry: Programs like Intel's ensure the U.S. stays competitive in this critical sector. I'm moved by and applaud Intel's commitment to workforce development. This initiative exemplifies the critical collaboration needed to bridge the skills gap and empower individuals to thrive in the new economy. What are your thoughts on apprenticeship programs? Let's discuss in the comments! https://bit.ly/46lfrcK

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simplified animation of our PCF process - simple here, but in reality- quite a challenge to do well (and we do this very well)

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Wide Range of Red Lasers Diodes to HeNe to DPSS for PDT, hair removal, illumination, machine vision, interferometry

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Time for a new episode of #NXP's Smarter World Podcast, featuring CTO Derek Dorresteyn at Damon Motorcycles. Learn how the company is setting a new standard for motorcycle safety and sustainability worldwide! ⚡🌏 Dive into the Smarter World Podcast for more insights.

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Hi Everybody! Please check out this quick video with Ashley from InBroadcast where we talk about the focus that MultiDyne is putting into our openGear products.

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Inspiring update from Dr. Laurie Locascio on the progress of CHIPS for America Act at SEMICOM West. $1.6B has been completely allocated to help the USA increase its share of worldwide semiconductor fabrication to 28% by 2032, creating millions of jobs. The next act is to allocate new funding to help the USA establish itself as an innovator, leader, and major provider for semiconductor packaging #semiconductors #USA #CHIPSforAmericaAct

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TSMC Teams Up with Amkor for Apple A16 Chip Manufacturing Amkor Technology has expanded its partnership with TSMC through a new memorandum of understanding to offer advanced packaging and testing services in Arizona. The collaboration will leverage technologies like Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS), bolstering the local semiconductor ecosystem. This partnership is in line with the U.S. CHIPS Act, which aims to localize the production of advanced chips. TSMC's Arizona facility is expected to produce 4nm process chips, possibly including Apple's A16 chip for the iPhone 14 Pro. Amkor, headquartered in Arizona, is set to invest $2 billion in a new facility to meet the capacity demands of shared customers with TSMC. The move is seen as a step towards self-sufficiency in chip production for consumer products like AMD's AI PC chips and NVIDIA's B-series GPUs. TSMC's 4nm process technology in Arizona is anticipated to partially fulfill U.S. demand, though the cost is estimated to be about 30% higher than in Taiwan. The partnership with Amkor is crucial for TSMC to diversify its production bases and enhance services for U.S. customers. 📧 Email: roy.lam@depend-ele.com 📞 Direct Line: 852 2362 9160 📱Mobile / Whatsapp: +852 6345 3850 💎 Visit us online: www.depend-ele.com Please follow, like, command, share my channel to get the daily market information, you are welcome to leave command to further discuss. #semiconductormanufacturing #semiconductorindustry #offer #oems #costdown #shortages #distributor #excessstock #excessinventory #consignment #automotiveelectronics #industrialautomation #iotsolutions #electroniccomponents #automotivetechnology #automotiveindustry #automotive #automation #global #sourcing #supercomputer #edgecomputing #electronicsmanufacturing #semiconductors #procurement #hybridcloud #ai #server #computing #artificialintelligence #healthcare #nvidia #processors #cloudserver #cloudstorage #datacenters #workstations #network #amd #manufacturing #cloudservices #networking #intel #memory #semiconductor #cloud #technology #innvovation #gpu #electronics #cpu #servers #supplychain #iot #leadership #deeplearning #bigdata #cloudcomputing #ems #smartphone #itad #5g #datacanter #Components #Semiconductors #ICs #CPU #MEMORY #SSD #GPU #HDD #MCU #EOL #Inventory #Excess #Slowmoving #Obsolete #Management #semiconductor #testing #qualityassurance #IndustryLeaders #TrustedPartners #SupplyChainExperts #ContactUs #SMBSupplyChains #SemiconductorSupplyChain #ElectronicsManufacturing #QualityComponents #SupplyChainTrust #Electronics #Engineering #Components #ClientSuccess #SupplyChainPartners #IndustryInsights #SupplyChainKnowledge #SupplyChain #GlobalReach #supplychain #supplychainsolutions #CoreValues #SupplyChainExcellence #ComponentsShortage #SupplyChainSolutions #Excess #Tech #Procurement #SupplyChain #GlobalLogistics

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Kelly Dack's January 3 column "Target Condition: Advanced Packaging Technologies—Look Before You Leap" in Design007 is well worth reading if you are looking at any of the myriad of new "solutions" to the challenges for packaging and assembly of new micro nm chips, chiplets etc. Just designing substrates with smaller dimensions is not sufficient. Nor is just going from 2D to 2.5D to 3D structures. The effects of heat, differing thermal coefficients of expansion affecting registration, uneven surfaces of build up layers, material compatibilities, different electrical properties of new materials, current distribution, etc. all contribute to the potential success or failure. We suggest planning carefully and engaging strong collaborating partners across the technology spectrums to enhance your chances of success.

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In the Southern California Area? Don't miss the Surface Mount Technology Association (SMTA) Los Angeles / Orange County Expo on Tuesday, November 5th from 10:00 AM - 3:00 PM. The SMTA LA/OC Expo provides a great platform to bring professionals within the industry together and provide attendees with exposure to global technology at a local level. In addition, the LA/OC Expo provides an opportunity to educate local engineers who may not be able to attend larger conferences and trade shows. Who You Will Meet? Process Engineers, Manufacturing Engineers, Production Managers, Engineering Managers, Quality Managers, Product Managers, Presidents, Vice Presidents, CEOs, Managers, Owners, Directors, and Buyers. There will be a free "Lunch & Learn" panel discussion on the subject of Ultra High-Density Interconnects (UHDI). An Introduction to Ultra High-Density Interconnects (UHDI) This panel discussion provides a comprehensive guide to Ultra High-Density Interconnects (UHDI) and their implications for the assembly industry. UHDI represents the next frontier in printed circuit board (PCB) design, enabling significantly higher routing density and miniaturization by utilizing fine-pitch traces, smaller vias, and advanced substrate technologies. Our expert panel consists of Tara Dunn, Director of Training and Education at SMTA, Anaya Vardya, CEO of American Standard Circuits, and Mumtuz Bora, Sr. Staff Packaging Engineer/ Backend Operations Manager at pSemi. The presentation begins by defining UHDI, exploring the technological advancements that have driven its development, and highlighting the key differences from traditional interconnect technologies. The presentation will also review the reasons for UHDI, delving into the factors pushing UHDI adoption, including the demand for smaller, lighter, and more powerful electronic devices, and the challenges of integrating complex functionality into increasingly constrained spaces. Finally, the presentation will review how UHDI will impact the assembly industry. It discusses the evolving requirements for precision assembly techniques, enhanced soldering processes, and inspection methods needed to meet the tighter tolerances of UHDI designs. The implications for supply chain management, manufacturing costs, and the importance of advanced testing methodologies to ensure reliability are also addressed. This guide equips assemblers with the knowledge they need to prepare for the transition to UHDI and stay competitive in a rapidly evolving technological landscape. Location: Highway 39 Events Center 1563 S State College Blvd, Anaheim, CA 92806 Cost: Free for members and non-members. Includes entry to expo, technical session, and lunch. Free registration here: https://lnkd.in/gcUabVaV

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Texas Instruments (TI) has secured a $1.6 billion award from the U.S. government under the CHIPS and Science Act to support the construction of three new 300mm wafer fabs in Texas and Utah. This funding will bolster TI's efforts to increase domestic semiconductor production, ensuring a reliable supply of essential analog and embedded processing chips for various industries. The company is committed to sustainable manufacturing practices, including the use of renewable energy and water conservation initiatives. TI's investment in these new fabs will create thousands of jobs and contribute significantly to the U.S. semiconductor industry. #TexasInstruments #TI #CHIPSandScienceAct #chips #chipmanufacturing #semiconductor #semiconductors #semiconductormanufacturing #semiconductorindustry #USA #innovation #technology #technologynews #sustainability

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UHDI and substrates: Forming clean microvias for subsequent metalization in build up circuitry to connect to a trace below is a challenge. Some recommend high frequency pulsed lasers to eliminate/minimize debris in the holes. Would a photo imageable build up film solve this challenge?

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From a materials standpoint, this is how I see the value chain for advanced substrates onwards. This value chain, however, is not a sequential structure; as technology becomes increasingly complex, disruptive innovations require simultaneous collaboration across all stages.

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Passive elements are integral to a multitude of electronic devices, ranging from mobile phones and computers to healthcare apparatus and industrial equipment. Their subtle yet essential function in influencing circuit performance is of great importance. In PCB design, these elements are carefully positioned and linked to produce specific results.

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This recent MarketEYE article by Kevin Sink, TTI, Inc. VP Total Quality, is centered around counterfeit parts and materials, including the latest trends in counterfeit electronic components and strategies to combat them. https://bit.ly/4g7pW7P #TTIinc

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This recent MarketEYE article by Kevin Sink, TTI, Inc. VP Total Quality, is centered around counterfeit parts and materials, including the latest trends in counterfeit electronic components and strategies to combat them. https://bit.ly/4g7pW7P #TTIinc

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Annular ring explained by a #PCBmanufacturer 🟨1. Annular establishes a reliable connection between a via and the copper trace. 🟨2. Use teardrop pads to increase the structural integrity of narrow traces (<20 mil). 🟨3. Ensure the ring width meets or exceeds the manufacturer's minimum requirements to prevent tangency or breakouts. Annular rings are one of the biggest concerns for #PCBdesigners. Even a slight misalignment during manufacturing can result in tangencies or breakouts, impacting the reliability of your printed board. 💡Read the blog to learn more: https://lnkd.in/gcJmqaMe --> Repost for better reach. #pcbfabrication #electronicsengineering #semiconductors

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