Jonathan Tillack

We have discovered a way to break a longstanding tradeoff in the design of a fundamental block used in phased arrays and signal processing systems! The humble, passive phase shifter featured in this article, published today in IEEE Transactions on Circuits and Systems I (Regular Papers), has achieved record-high resolution for a digitally controlled delay element (10 bits), while maintaining low insertion loss. Typically, higher resolution worsens loss due to resonances, finite Q, etc. We addressed this issue by moving beyond those resonances and working in a 'post-resonance regime' — a simple yet powerful idea! Please give it a read and share your thoughts! https://lnkd.in/eT7pUJwV

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The importance of decoupling capacitor placement and connection to an IC is often overlooked. This is a good article.

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In engineering, precision is paramount. Whether it’s performing quality assurance on cutting-edge electronics or debugging complex systems, the accuracy of measurements can make or break a project. But not all oscilloscopes are created equal: here's why ADC and low noise floor matter: https://lnkd.in/exfah-X7 via Keysight Technologies #oscilloscopes #testandmeasurement

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Today's episode of the Altium® OnTrack podcast features SI legend Donald Telian. We talk old school vs. new school signal integrity and what has driven the shift to equalization as a major part of modern signal integrity. I hope you enjoy listening to this episode as much as I enjoyed recording it! https://lnkd.in/gvghmJ-i #pcbdesign #electronicsengineering #signalintegrity

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Stephen V. Chavez delves into PCB's future with Anaya Vardya from American Standard Circuits! HDI and Ultra HDI are revolutionizing electronics with denser layouts and superior signal integrity. Uncover the challenges, collaboration tips, and the power of education in mastering these tech marvels. https://lnkd.in/gksAm32s

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What is #IPC A-600? IPC-A-600 – also called IPC-600 – sets the level of acceptance criteria for each class of product. It provides graphical illustrations of the ideal, admissible, and non-negotiable conditions that are externally or internally observable on printed boards. The imperfections on the board’s exterior surface that can be seen and evaluated are called externally observable conditions. Internally observable conditions are features that need microsection evaluation of the specimen to check acceptability. Some internal anomalies can project outside as voids or blisters. The boards should be sufficiently illuminated for effective evaluation. By following this inspection process, it is measured whether the physical features of the final board are in accordance with the requirements. The IPC-A-600 document provides the visual interpretation of minimum requirements set forth in various printed board specifications, such as the IPC-6010 series and J-STD-003. These standards apply to rigid, metalcore, HDI, rigid-flex, and flexible printed circuits. This document is designed to make sure that the PCBs conform to layer-to-layer spacing, the structural integrity of laminates, the physical dimensions of copper features, etching characteristics, and plating standards. The examples of features that are scrutinized using this standard are: Final PCB thickness Hole characteristics (e.g., size) Solderability Dielectric thickness & solder mask errors Existence of copper voids Annular ring requirements and drill breakouts Surface/Subsurface imperfections Anomalies in conductive circuitry -- Read the blog for more. #pcbfabrication #pcbmanufacturing #electricalengineering

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Attention Altium Users: Altium is removing the perpetual license option to exclusively offering subscription/time-based licenses. How do you feel about this change? Are you planning to work with your Altium account manager to transition your perpetual licenses to a subscription model, or are you considering other ECAD software options?

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Ultra high-density interconnect (UHDI) is a PCB manufacturing technology that involves the use of extremely fine traces, spaces, and microvias to allow for more components and connections within a smaller area and potentially reduce the PCB stackup layer count. This results in high-density circuitry that can fit into compact devices without compromising performance or functionality. https://sie.ag/6PgBFV #PCBDesign #HDI #ElectricalEngineering

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If you're still considering joining the Elite Hardware Engineer Program, our group coaching sessions kick off tomorrow, Saturday 14th at 7 am CST. The schedule can be adjusted based on tomorrow's meeting poll, potentially adding more sessions. Looking to enhance your engineering skill set with DFx, signal integrity, hardware design, and more? Dive in to grasp new designs with ease and speed in just 3-5 months, saving years of learning time. Unique features include accelerated learning methods and simplified PCB design mastery. With a focus on practical skills and mind-hacking techniques, this program guarantees rapid expertise development, regardless of your background. While pricing is on the higher end, the investment promises life-changing opportunities and boosted confidence as a hardware engineer. Benefit from ongoing support, access to industry experts, and software training in OrCAD and Altium Designer. What you get: Design for Excellence (DFx, DFM, DFF, DFT, DFA), signal integrity, EMC/EMI, high-speed hardware and PCB design (for I2C, HDMI, DDR3, USB3.2, etc.) to your electrical and electronics engineering tool set. With how the lesson planning is laid out, you have no choice but to become an expert. By the end of project 4, you can look even at any new designs or courses with the ultimate PCB layout and hardware design lenses (where you absorb all new information 10 times more easily, now that you have a firm foundation) and know what's going on. Enroll now to gain advanced junior hardware engineer skills and understand senior engineers' decision-making processes. Exciting material additions are coming in November for continuous learning and growth (like rigid flex and RF). See you in the course! Enrollment link in the comments below. 👇

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Abaco Systems uses the full power of our electronic systems design tools, including Xpedition for design authoring and library management, HyperLynx for signal and power integrity analysis, and Valor for DFM validation. “We push the Siemens tools very hard,” said Rob Savage, PCB engineering manager. “The tools themselves are a very important aspect of what we do here. It may be that a lesser tool could be employed but the time scales involved in that would just be horrific. We need the fastest, most efficient tools that we can have to get our very complex designs to market on time. We get that from the Siemens tools.” Abaco Systems envisions a future where they continue to be a leading technology provider that can pack the most circuitry and the most density on a board to get the highest processing power. “We are doing things at the cusp of the technology,” said Mike Underwood, division vice president and business unit manager. “You can do all that with the right tools, the right processes, and the right people. With the Siemens electronic system design tools, we can do powerful things.” #PCBDesign #ElectricalEngineering #PCB

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RM154: Thermal Profiling Best Practices https://lnkd.in/gpBAAcZJ A Reliability Matters podcast with Mike Konrad. Mike and Mark Waterman discuss what thermal profiling is, why it’s important, and how it affects everything from solder joint integrity to component placement.

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After spending this week talking about Leadless ICs, it's time to see how you change them on your Printed Circuit Board. Owner/Operator Raymond Novara goes step by step with how to change a Leadless IC on a PCB board. Subscribe to our YouTube Channel for more tips! Tips of the Trade: Changing Leadless ICs https://lnkd.in/eN4-wyH6 #Eastendassemblies #nasa #pcb #leadlessic #leadlesschipcarrier #chipcarrier #surfacemounting #longislandbusiness #electricalengineering #electricalindustry #soldering #solder #assembly #designformanufacturing #designengineering #engineering #pcbassembly

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Great series with explanations comparing related but different RF instruments.

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Some insights into PCB Assembly: https://lnkd.in/gPm8Z82m

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💡 PCB design is full of rules of thumb—some built on DFM formulas, others passed down as industry “tribal knowledge.” In a fun chat, Andy Shaughnessy talks with experts Kris Moyer and Kelly Dack about when to trust these shortcuts, when to do the math, and how to find the right balance ⚖️. It’s all about smart, practical design: https://lnkd.in/g_BJQDbX

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Fast frequency hopping to amplifier stability. Read the newest issue of our Analog Design Journal on analog circuit design techniques and emerging applications. #adj #electricalengineering https://lnkd.in/gBEqYYG9 ​

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MALVERN, Pa. — July 24, 2024 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of AEC-Q200 qualified thin film chip resistors that provide high frequency performance up to 70 GHz for automotive, space, avionics, telecom, and military applications. Offered in the compact 02016 case size, the Vishay Sfernice CHA series is available in a wide range of resistance values from 10 W to 500 W. The devices released today offer very low internal reactance and exhibit behavior close to a pure #resistor over their large frequency range, with a nearly flat Z/R curve to 70 GHz. The microwave resistors maintain their high frequency stability even after the most stressful AEC-Q200 tests — validated by their ΔR and Z/R measurements — guaranteeing high #performance under harsh environmental conditions. The CHA series is ideal for #automotive ADAS, LIDAR, connectivity, and 4D radar systems; LEO satellites and space communication systems; military guidance and telemetry systems; drones; and #RF antennas. For these applications, the devices provide limiting voltage of 30 V, rated power of 30 mW at +70 °C, and a temperature coefficient of ± 100 ppm/°C, with ± 50 ppm/°C available on request. To reduce #development time and costs, the devices’ S-parameter data is available for electronic simulation, in addition to 3D models for Ansys® HFSS™, Modelithics Microwave Global Models™ (PCB and pad-scalable), and design kits. RoHS-compliant, halogen-free, and Vishay Green, the resistors are offered in tape and reel packaging. #Vishay #semiconductor #ic #electroniccomponents #electronics #technology

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OrCAD X 23 is one of the tools that I support doing PCB Design at ECAD Central. OrCAD X 24.1 has been out for about a month so you may want to check out some of the new features, especially if you are considering switching over from another tool set.

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Two of the biggest challenges in doing reverse engineering on today's SMT PCBs are BGA and unknown components. The first has to do with accessing the hidden pins and the density of the component footprints. The second has to do with the lack of datasheet and more importantly, pin configuration. While there are no straight and simple answers, there are strategies and workarounds that can help to reconstruct the schematics. These are addressed in my book Manual PCB-RE: The Essentials, in which I detailed the process of reversing a Gigabyte GeForce 8600GT graphics card. #PCBreverseengineering https://lnkd.in/g8S_Zvj9

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