nilesh Ingale

If you are new to Formal Verification, I have 3 articles on systemverilog.io to get you started. 1. 𝗦𝗩𝗔 𝗯𝗮𝘀𝗶𝗰𝘀 - Will build the necessary foundation in SVA, with lots of examples 2. 𝗔 𝗴𝗲𝗻𝘁𝗹𝗲 𝗶𝗻𝘁𝗿𝗼𝗱𝘂𝗰𝘁𝗶𝗼𝗻 𝘁𝗼 𝗙𝗼𝗿𝗺𝗮𝗹 𝗩𝗲𝗿𝗶𝗳𝗶𝗰𝗮𝘁𝗶𝗼𝗻 - What is Formal, how is it different from Functional Verification. 3. 𝗔 𝗯𝗹𝘂𝗲𝗽𝗿𝗶𝗻𝘁 𝗳𝗼𝗿 𝗙𝗼𝗿𝗺𝗮𝗹 𝗩𝗲𝗿𝗶𝗳𝗶𝗰𝗮𝘁𝗶𝗼𝗻 - End-to-end strategy for someone new to Formal Link: https://lnkd.in/gZTBX46K These were written in 2019, but is still a good place to start. If you have a Synopsys SolvNet account, you can also watch a talk I gave in SNUG 2019. ~~~ Join 1500+ readers in my upcoming newsletter: svio.link/newsletter #verilog #systemverilog #formalverification #asic

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Just a thought RTL Design has few logics which is not required as per the design specifications, this portion of code gets excluded in code coverage analysis. By knowing this fact we still synthesis the logic and it increases the gate counts. but functionaly this logic has no use. Now can this be a area for AI based tool to discard that portion of logic during synthesis and we reduce the gate count?

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Basic and Simple Blueprint to structure a project in UVM [Important for VLSI Professionals] UVM is a preferred verification language due to its reusability, scalability, interoperability, CRV, proper phasing, etc. Below are the most simplest basic steps mentioned as how to develop a TB infrastructure from scratch. Step 1: Documentation ✓ Go through the specification thoroughly and prepare the Verification Plan, Test Plan, Assertion Plan and understand the working of the IP or protocol. Step 2: Coding ✓ Code the interface by listing all the I/O port. Code the Clocking block to avoid race condition, synchronization and direction to TB. Optionally code the Modport. *** Note: Cautiously use the input / output skew and the clockvar There are certain rules while using the Clocking block and modport which someone needs to follow. **** ✓ Code the transaction class and use the randomization wherever applicable. Try to avoid the field macros and instead use proper methods. **General thumb rule the input should be rand. Moreover try to use the do_copy, do_ compare, convert2string, do_print methods instead of using field macros which has a overhead** ✓ Code the driver logic for the pin level activity at DUT. Use sequencer driver handshake properly depending on pipelined / non pipelined access. *** Use proper coding guidelines while coding driver logic *** ✓ Code the Sequencer and use arbitration mechanism if needed. ✓ Code the Monitor to handle the transaction. The analysis port first needs to be connected to Agent and then to other subscribers like scoreboards, etc. ✓ Build the agent and give proper instantiation for Driver, monitor, and Sequencer. Depending on application the Agent can be chosen as either active or passive. ✓ Code the env class and give proper connection. ✓ Write some basic sequence items to check the flow along with base test class. While coding the sequence items number of methods can be used to execute the sequence. ** While using the sequence use start_item/finish_item instead of `uvm_do macro ** ✓ Code the scoreboard either with the help of tlm fifo, associative array, queue depending on whether it's used in order or out of order comparator. The coding style will change depending on need. ** While designing the Scoreboard make sure the predictor and evaluator are separate** There are almost 6 to 7 different methods of designing a scoreboard ✓ Code the top module and use of run_test and set the config db. *** Above are some of the very basic steps mentioned but ideally the testbench will be complex and use many more concepts which are not mentioned above. Some of them are: ✓ Virtual Sequencer and Virtual Sequences. ✓ RAL ✓ Callbacks ✓ Objection mechanism ✓ Config and resource db ✓ Coverage ✓ Assertions #vlsi #asic #electronics #electricalengineering

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Class B amplifiers are sometimes OK for RF but not audio. Why? 👇🏽 Class B amplifiers provide a highly distorted output signal, but with good amplification efficiency. For many RF applications, it is okay to distort the carrier signal as long as the modulation is not affected. The baseband information can still be retrieved. Class B won't work for audio. It is a complex time-varying signal which needs to be accurately amplified. To still get Class B efficiencies, the push-pull amplifier was invented. It is a differential version of a Class B amplifier that can produce amplification with good efficiency. If you'd like to learn more about Class B and push-pull amplifiers, stay tuned for this week's newsletter. ✍🏼 Sign up here: www.viksnewsletter.com What is your experience with Class B or audio? Let me know! ~~ 🔔 Follow me for posts on RF engineering ♻️ Repost if you found it useful.

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Tackling Data Retention in SSDs (by Anil Burra from Intelligent Memory) 🤩 "SSDs have conquered the market due to their speed, durability, energy efficiency, and small form factor. However, write endurance and data retention are concerns in #embedded and #industrial applications, especially as the technology moves to ever smaller nodes." (Anil Burra) With the scaling of #NAND #flash #technology to higher densities (e.g., Triple-Level-Cell or Quad Level-Cell) and smaller process nodes, data retention becomes more challenging due to increased cell-to-cell interference and reduced margins for charge storage. Therefore, newer #technologies may have shorter specified data retention periods compared to older, more robust #SLC (Single-Level-Cell) or #MLC (Mul ti-Level-Cell) #NAND products. Two key factors affect data retention, the period over which #flashmemory can store #data without loss or corruption, in #NANDflash cells: program/erase (P/E) cycling and operating temperature. A very big thank you to Anil Burra from Intelligent Memory for this insightful article via Electronic Specifier Ltd with more background and insights via the link below 💡🙏👇 - A very good read to an important TOPIC 🤩 https://lnkd.in/eqdH7-N2 #semiconductorindustry #semiconductormanufacturing #innovation #it #ai #ssd #datastorage #automotiveindustry #embeddedsystems #ic #computer #computing #iot #memory #chip #chips #technology #tech

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BREAKING: A POTENTIAL Qualcomm-Intel MERGER COULD Reshape the Semiconductor Industry Amid Intel's Struggles. US network CNBC has confirmed that Qualcomm recently approached Intel Corporation about a possible takeover. While it remains unclear if Intel has engaged in formal discussions or what the terms might be, this potential merger—if it goes through—could rank among the most significant tech deals in history, with Intel’s market cap exceeding US $90 billion. Once the global leader in chipmaking, Intel has experienced a steady decline, a situation exacerbated in 2024. The company reported disappointing earnings earlier this year, triggering the largest single-day stock drop in over five decades. Intel shares have plummeted 53% year-to-date as investors question its costly strategy to manufacture and design its own chips. This contrasts sharply with Qualcomm’s more asset-light approach, which relies on partners like TSMC Semiconductor Manufacturing Company and Samsung Semiconductor for production. Intel’s efforts to bounce back include a bold $100 billion investment plan to expand its foundry business over the next five years, but the firm has struggled to capitalize on the booming artificial intelligence (AI) market. NVIDIA, not Intel, has claimed more than 80% of the rapidly growing AI chip market, especially for systems like ChatGPT. Qualcomm, despite generating less revenue than Intel in 2023 (US $35.8 billion vs. $54.2 billion), might see the potential for a broader market share and technical synergies from a merger, particularly in the AI space and computing. Boardroom Moves & Strategic Delays Intel CEO Pat Gelsinger has recently sought to reassure employees of the company’s long-term vision, emphasizing its commitment to the foundry business. However, in a significant update, Intel also announced the delay of its Magdeburg project in Germany—a cornerstone of Europe's semiconductor manufacturing ambitions—pausing construction for two years. A Qualcomm-Intel merger, however, wouldn’t come without hurdles. Both companies have faced antitrust scrutiny in the past, especially from Chinese regulators. Intel’s failed bid for Tower Semiconductor and Qualcomm's blocked attempt to acquire NXP Semiconductors are cautionary tales of how international regulatory frameworks can derail deals. The national security landscape also looms large—Broadcom's $100 billion bid to acquire Qualcomm was blocked in 2018 by the Trump administration over concerns about foreign ownership. Similarly, Nvidia’s attempted purchase of Arm was shelved in 2022 following pressure from regulators in multiple regions. What is ahead? Both companies have declined to comment, but the stakes are clear: A successful merger would signal a dramatic realignment of power in an industry critical to everything from consumer electronics to defence technologies. And what about the impact on photonics? #Qualcomm #Intel #Mergers #AI #NationalSecurity #Chipmaking #Nvidia #TSMC

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Recently, Apple has launched the iPhone 16 series, enabling WiFi 7 for iPhone users. Let us do some brief system-level calculations to understand noise and ADC requirements.   Assumptions: Modulation Scheme: 4096-QAM Channel Bandwidth: 320 MHz Received Power (P_RX): -50 dBm Front-end RX Gain ( G ): 25 dB Front-end Noise Figure ( NF ): 10 dB Thermal Noise Power Density ( N_0 ): -174 dBm/Hz Step 1: Thermal Noise Power Calculation The noise power density is a function of thermal noise at room temperature (290K). Given the bandwidth B = 320 MHz, the total noise power over the bandwidth is: N_total = N_0 + 10log10(B) N_total = -174 + 85.05 = -88.95 dBm Step 2: Adjust for Noise Figure by Front End The receiver’s noise figure (NF) adds noise to the system. Adjust the total noise power by the noise figure: N_output = N_total + NF N_output = -88.95 dBm + 10 dB = -78.95 dBm This represents the total noise power at the output of the front end. Step 3: Signal Power at the ADC Input The signal power at the input of the ADC is the received power amplified by the front-end gain (G = 25 dB). P_ADC_in = -50 dBm + 25 dB = -25 dBm Step 4: Signal-to-Noise Ratio (SNR) Calculation The SNR at the ADC is the difference between the signal power at the ADC input and the total noise power at the output: SNR = P_ADC_in – N_output SNR = -25 dBm - (-78.95 dBm) = 53.95 dB This is the SNR at the input of the ADC. Step 5: Determine the ADC Resolution (ENOB) The effective number of bits (ENOB) of the ADC can be determined from the SNR using the relation: SNR = 6.02 x ENOB + 1.76 dB ENOB = (SNR - 1.76) / 6.02 ENOB = (53.95 - 1.76) / 6.02 = 8.67 bits Step 6: Verify SNR Requirement for 4096-QAM For 4096-QAM, the required SNR can be approximated by: SNR_required = 10log10(M), where M = 4096 for 4096-QAM SNR_required = 10log10(4096) = 36 dB Since the calculated SNR at the ADC input (53.95 dB) exceeds the required SNR for 4096-QAM (36 dB), the system is well within the acceptable range for decoding the signal. Step 7: ADC Full-Scale Dynamic Range To ensure proper ADC operation, the full-scale range of the ADC should encompass both the noise floor and the signal power. The total noise power at the ADC input: N_output = -78.95 dBm The signal power at the ADC input: P_ADC_in = -25 dBm Thus, the required dynamic range (difference between the signal and noise) is: Dynamic Range = P_ADC_in – N_output = -25 - (-78.95) = 53.95 dB The ENOB of 8.67 bits corresponds to a dynamic range DR = 6.02 x 8.67 = 52.2 dB This is close to the 53.95 dB SNR at the input of the ADC. Conclusion: For a typical WiFi 7 system with 4096-QAM and 320 MHz bandwidth: Required ADC ENOB: 8.67 bits. However, a nominal ADC resolution of 10 bits would provide adequate performance with design margins for implementation losses, ensuring the system can properly digitize the incoming signal. *Please note that Front End gain is a variable that also plays a crucial role in properly functioning WiFi Receiver.

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As retail and enterprise customers start thinking about new investment in Android devices, here is a nice blog on how to think of long term TCO for your platforms.

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New #Micron blog post | Why latency in data center SSDs matters and how Micron became best in class, by Steven Wells (Fellow, Architect Storage Systems) READ: https://lnkd.in/e2tbu443 #SSD #NAND #LatencyMitigation

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Advancing Cache Memory Technology: Innovations in High-Speed L1, L2, and L3 Memory. . . #semihpc.com,#AMD,#HPC,#V_Cache,#Semiconductor I came across a report stating that AMD plans to release the AMD Ryzen™ 7 9800 X3D chip, which has improved computing capabilities by applying 3D V-Cache 2nd Gen technology. It is said that they have alleviated heat issues by changing the vertical positioning of the chip compared to the existing structure. I appreciate AMD’s efforts to take on challenges and make progress in this way, much like NVIDIA did in the past. Additionally, I believe that the issue of increasing the density and arrangement of high-speed L1, L2, and L3 memory is just as important in the high-performance computing field as the adoption and application of high-bandwidth, high-density DRAM like HBM. While it’s true that there are several difficulties and that advancing the technology and commercializing it is costly, it’s clear that accumulating related technology and moving forward is important. Of course, competitors who are closely monitoring and preparing highly refined solutions focused on critical technologies can always be burdensome, but it seems more likely that those who have handled hot and risky technologies with their own hands will have the opportunity to get ahead. Whether the 2T0C Base’s 3D Memory Cell technology is incorporated inside the chip or advances as an independent high-density memory and is combined with CPUs or GPUs through hybrid bonding technology—as these two forms of progress advance simultaneously and the hierarchy of L1 and L2 cache memory, L3 cache memory, and main DRAM memory becomes more subdivided—it seems clear that various efforts to achieve new advancements will unfold soon.. . https://lnkd.in/gsBmP_id * I would like to clarify that mentioning Stanford's research alongside AMD's product is solely intended to present my opinion on future advancements in memory technology and does not imply any direct connection between them.

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To my friends in India who are asking where they can get a copy of “Next Level Testbenches: Design Patterns in SystemVerilog and UVM:” My understanding is that KDP (Kindle Direct Publishing, the publishing arm of Amazon) does not have a print on demand plant in India. Instead, Amazon India buys books from distributors in the US and the UK and resells them in India. However, they only buy paperback books, not hardcover books. So, I put together a paperback edition with identical content as the hardcover edition. The paperback edition launched this week on Amazon with “extended distribution,” which gives permission to be sold through international distributors. I don’t know when it will reach the Indian market. The KDP website says it could take up to eight weeks to get through the distribution network. In the meantime, it’s available on amazon.com, amazon.uk, and other European markets. I’m still learning how the international publishing market works. Thank you for your patience. P.S. Ebooks were not in my original plans. There are some challenges converting a book formatted for print into an ebook. I’ll look into it, but cannot promise an ebook edition will be available.

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Marvell Technology is riding the AI boom, with custom AI chip demand pushing its stock to record highs. The company forecasts $1.8 billion in Q4 revenue, beating analysts' $1.65 billion estimate. Its data center segment alone doubled YoY to $1.1 billion, solidifying Marvell’s position as a leader alongside Broadcom in the custom chip market, projected to reach $45 billion by 2028. AI's rapid growth is reshaping industries, and custom chips are fueling innovation. What’s your take on their impact?

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The first two chapters of 𝐏𝐲𝐭𝐡𝐨𝐧 𝐟𝐨𝐫 𝐀𝐒𝐈𝐂/𝐒𝐨𝐂 𝐞𝐧𝐠𝐢𝐧𝐞𝐞𝐫𝐬 are now live. https://lnkd.in/gk_pUuFk - 𝐂𝐡𝐚𝐩𝐭𝐞𝐫 𝟏 jumps right in and discusses the two workhorse data structures: 𝐋𝐢𝐬𝐭𝐬 𝐚𝐧𝐝 𝐝𝐢𝐜𝐭𝐢𝐨𝐧𝐚𝐫𝐢𝐞𝐬. Comparing these to SV queues and associative arrays. - 𝐂𝐡𝐚𝐩𝐭𝐞𝐫 𝟐 is about 𝐍𝐮𝐦𝐛𝐞𝐫𝐬. In SV we take hex/bin/int conversion, bit manipulation and randomization for granted. You'll learn how these are done in Python. Each chapter is short and quick to go through. Even if you're new to Python, it shouldn't take you more than 20-30 mins. You can sign up here to be notified when the next chapters drop: https://lnkd.in/ghmAmkDR ~~~ Follow my work: chiplog.io - non-technical engineering stuff systemverilog.io - the best tutorials for chip development #python #systemverilog #asic #semiconductor

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🌟 SystemVerilog (SV) vs Universal Verification Methodology (UVM) 🌟 In the world of VLSI Verification, two critical terms often come up: SystemVerilog (SV) and Universal Verification Methodology (UVM). While they are interconnected, they serve distinct purposes in the verification ecosystem. Here's a concise comparison: 1️⃣ SystemVerilog (SV) Definition: SystemVerilog is a hardware description and verification language (HDVL) that extends Verilog with powerful features for RTL design and verification. Purpose: Provides constructs for design, testbench creation, and low-level verification tasks. Features: Assertions (SVA) for design verification. Randomization for creating diverse test scenarios. Object-oriented programming (OOP) support. Use Case: Suitable for small-scale projects or standalone modules where custom testbenches are created without a structured methodology. 2️⃣ Universal Verification Methodology (UVM) Definition: UVM is a framework built on top of SystemVerilog that standardizes testbench architecture for functional verification. Purpose: Enables scalable, reusable, and industry-standard verification processes. Features: Pre-defined classes for stimulus generation, checking, and coverage. Powerful component hierarchy: Agents, Drivers, Monitors, and Scoreboards. Built-in support for constrained-random verification and functional coverage. Use Case: Ideal for complex designs and large-scale projects requiring reusable verification components and a systematic approach. Key Differences AspectSystemVerilogUVMScopeLanguage for design and verificationMethodology for verification onlyComplexitySuitable for simpler projectsBest for large, hierarchical designsReuseLimited reuse potentialHighly reusable componentsLearning CurveEasier to learnRequires understanding of SV and UVM concepts Which to Choose? For beginners: Start with SystemVerilog to build a solid foundation. For industry-standard verification: Transition to UVM for structured, reusable, and scalable testbenches. SystemVerilog and UVM complement each other, forming the backbone of modern verification flows. Mastering both is key to excelling in the VLSI industry! 🚀 Let me know your thoughts or experiences with SV and UVM! #SystemVerilog #UVM #VLSI #Verification #Semiconductors

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🔍It’s no mystery: there's no #AI without #hardware. As AI continues to help solve great mysteries from the ocean to space, here’s one I can help solve: custom chip #tech is mission-critical for the #future of AI. Unpack more insights in #ConnectingAI: https://lnkd.in/gw3jBcuJ #artificialintelligence #machinelearning

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📢 U.S. firm Allegro MicroSystems opens R&D centre in #Hyderabad, to #hire 400 🔥 💡 🔹️Nearly 100 highly skilled professionals have been onboarded and there are plans to scale the headcount to 500 in near future 🔹️ ▪️ #Magnetic #sensing and #power #IC solutions provider Allegro MicroSystems of the U.S. has opened a research and development centre in Hyderabad. ▪️ Nearly 100 highly #skilled #professionals have been #onboarded and there are plans to scale the #headcount to 500 in near future. The facility will be instrumental in #developing #cutting-#edge solutions for e-mobility, clean energy and automation. Setting up of the centre underscores Allegro MicroSystems commitment to advancing #India’s #semiconductor vision and highlights #Telangana’s strategic role in building a resilient, world-class semiconductor ecosystem, Industries and IT Minister D.Sridhar Babu’s office said on the R&D centre opening and the company’s senior leadership meeting him at the Secretariat on Friday (November 15, 2024). ▪️ The R&D facility will be a centre of excellence in #analog and #mixed-#signal #design, #verification and #validation for the #EV, #automotive and #robotic automation markets, driving advanced technological development and positioning Hyderabad as a leader in emerging technology solutions. Allegro MicroSystems’s decision to expand operations in Hyderabad aligns with the city’s robust infrastructure, skilled talent pool and supportive government initiatives. The company’s plans to grow headcount in Hyderabad will create significant job opportunities for skilled professionals, it said. ▪️ The setting up of the centre is a “significant step forward in our global product innovation strategy. Hyderabad’s exceptional talent pool, supportive government policies and strategic location make it an ideal hub for Allegro MicroSystems’s expansion,” CEO Vineet Nargolwala said. ▪️ India is on the verge of a semiconductor revolution and the shift towards electric vehicles is set to drive semiconductor demand since #EVs require significantly more chips than traditional vehicles. India, however, imports over 90% of its semiconductors, the Minister said. Electronics Sector Skills Council Of India (ESSCI) | I) | Electronics India For You | India Electronics and Semiconductor Association | FICCI | India Semiconductor Mission | Semiconductor Nation - Campus Connect | Semicon India | SEMI India | Semiconductor and Electronics | StatsMarketResearch | IETE IETE IETE BIT Mesra, R | hi | IETE | November 15, 2024 | #HYDERABAD | The Hindu Bureau | #AllegroMicroSystems | #chip | #US | #semiconductor | #fabrication | #Jobs | #Business | #market | #technology | #RnD | #RandD | #Semiconductors | #Wafer | thehindu.com #Details— https://lnkd.in/g25E-ia5

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The end of an era. We wait to see how the story moves forward for a great technology company. The PC and Data Center market needs the scale that Intel brings. Intel Announces Retirement of CEO Pat Gelsinger. David Zinsner and Michelle Johnston Holthaus named interim Co-CEOs. Holthaus also appointed to the newly created position of CEO of Intel Products. Frank Yeary named interim executive chair. SANTA CLARA, Calif., Dec. 2, 2024 – Intel Corporation (NASDAQ: INTC) today announced that CEO Pat Gelsinger retired from the company after a distinguished 40-plus-year career and has stepped down from the board of directors, effective Dec. 1, 2024.  Intel has named two senior leaders, David Zinsner and Michelle (MJ) Johnston Holthaus, as interim co-chief executive officers while the board of directors conducts a search for a new CEO. Zinsner is executive vice president and chief financial officer, and Holthaus has been appointed to the newly created position of CEO of Intel Products, a group that encompasses the company’s Client Computing Group (CCG), Data Center and AI Group (DCAI) and Network and Edge Group (NEX). Frank Yeary, independent chair of the board of Intel, will become interim executive chair during the period of transition. Intel Foundry leadership structure remains unchanged. The board has formed a search committee and will work diligently and expeditiously to find a permanent successor to Gelsinger. Yeary said, “On behalf of the board, I want to thank Pat for his many years of service and dedication to Intel across a long career in technology leadership. Pat spent his formative years at Intel, then returned at a critical time for the company in 2021. As a leader, Pat helped launch and revitalize process manufacturing by investing in state-of-the-art semiconductor manufacturing, while working tirelessly to drive innovation throughout the company.” Yeary continued, “While we have made significant progress in regaining manufacturing competitiveness and building the capabilities to be a world-class foundry, we know that we have much more work to do at the company and are committed to restoring investor confidence. As a board, we know first and foremost that we must put our product group at the center of all we do. Our customers demand this from us, and we will deliver for them. With MJ’s permanent elevation to CEO of Intel Products along with her interim co-CEO role of Intel, we are ensuring the product group will have the resources needed to deliver for our customers. Ultimately, returning to process leadership is central to product leadership, and we will remain focused on that mission while driving greater efficiency and improved profitability.” #intel #nvidia #amd #tsmc #semiconductors #ai #succession #CPU #x86 #chipsact #leadership #innovation

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"Chiplets are quickly becoming an integral part of the high-performance compute world, thanks to their versatility and scalability, but utilizing them comes with some unique challenges involving signal integrity, power integrity, and integration" #semiconducotrindustry #chiplet https://lnkd.in/d5bQizT6

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