Robert Quinn

It's beyond me why Congress sends billions overseas to friend and foe alike, but does not approve $45 million for printed circuit manufacturing under the Defense Production Act which is less than the total cost of a single substrate factory to produce Ultra High Density Interconnection PCBs. These are the required platforms for the packaging of semiconductors needed for defense, medical and AI applications. The lack of federal support to regenerate and advance this capability leaves the US. primarily dependent on facilities in Asia. Fortunately, TSMC and Amkor are teaming up to provide the complete process from chip to tested package in Arizona. This will help, but not provide adequate service for all the other chip makers investing in the U.S. that will still have to ship most of their ICs back to Asia for packaging. The U.S. needs to provide better incentives to stimulate domestic investment in the supply chain for the domestic production advanced electronic packages. The U.S. Dept. of Defense (DoD) announced an award of $30 million to TTM Technologies to ramp up U.S.-based production of ultra-high density (U-HDI) printed circuit boards (PCBs) at a facility being developed in Syracuse, NY. TTM is expected to invest up to $130 million for the new facility and create an additional 400 “good paying” jobs, bringing the company’s Central New York workforce to 1,000, according to the the office of New York Governor Kathy Hochul. From the IPC: Action Alert! Help IPC Secure U.S. Defense Electronics Funding: IPC is calling on you to take immediate action to support legislation that strengthens U.S. defense electronics manufacturing. As Congress finalizes government funding for Fiscal Year 2025, the Senate’s version includes $45 million for printed circuit board (PCB) manufacturing under the Defense Production Act (DPA) account. However, unless the House follows suit, this funding could drop to zero, leaving the U.S. dependent on non-domestic sources of the PCBs that power all defense electronics.

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Texas Instruments (TI) has secured a $1.6 billion award from the U.S. government under the CHIPS and Science Act to support the construction of three new 300mm wafer fabs in Texas and Utah. This funding will bolster TI's efforts to increase domestic semiconductor production, ensuring a reliable supply of essential analog and embedded processing chips for various industries. The company is committed to sustainable manufacturing practices, including the use of renewable energy and water conservation initiatives. TI's investment in these new fabs will create thousands of jobs and contribute significantly to the U.S. semiconductor industry. #TexasInstruments #TI #CHIPSandScienceAct #chips #chipmanufacturing #semiconductor #semiconductors #semiconductormanufacturing #semiconductorindustry #USA #innovation #technology #technologynews #sustainability

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MCC (Micro Commercial Components) Introduces 150 W TVS Diodes for Industrial and Consumer Electronics Read more: https://ow.ly/7R2e50Tjjeo #powerelectronics #tvsdiode #industrial #consumerelectronics #semiconductor #powermanagement #transientvoltage #voltagesuppressor #circuitprotection

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https://lnkd.in/eazjgZYa TSMC Introduces “Foundry 2.0” to Include Packaging, Testing, Mask making and Others. #tsmc #technology #innovation #business #Semiconductorindustry #electronics #semiconductor #supplychain #engineering #manufacturing #computerchips #semiconductors #chips #chipmaker #foundry credit: trendforce

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Kelly Dack's January 3 column "Target Condition: Advanced Packaging Technologies—Look Before You Leap" in Design007 is well worth reading if you are looking at any of the myriad of new "solutions" to the challenges for packaging and assembly of new micro nm chips, chiplets etc. Just designing substrates with smaller dimensions is not sufficient. Nor is just going from 2D to 2.5D to 3D structures. The effects of heat, differing thermal coefficients of expansion affecting registration, uneven surfaces of build up layers, material compatibilities, different electrical properties of new materials, current distribution, etc. all contribute to the potential success or failure. We suggest planning carefully and engaging strong collaborating partners across the technology spectrums to enhance your chances of success.

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Taiwan is taking steps to ensure that its domestic semiconductor industry, particularly TSMC, maintains its technological edge. Despite the growing trend of global chip manufacturing, Taiwan is implementing regulations restricting the transfer of its most advanced process technologies to overseas facilities. This move is designed to safeguard Taiwan's position as a critical hub for advanced chip production and strengthen its strategic partnership with the U.S. While the U.S. invests heavily in domestic semiconductor manufacturing, Taiwan's role as a key supplier of leading-edge chips remains essential. #TSMC #TechGiants #Foundries #Taiwan #USA #chips #semiconductor #semiconductors #semiconductorindustry #semiconductormanufacturing #technology #innovation #chipmanufacturing #globalization #geopolitics

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Scalable RFIC Test Card Solves Test Challenges for Wide-Bandwidth Applications from 100 MHz to 20 GHz Advantest Read more: https://ow.ly/YLFv50UaMFY #testandmeasurement #rfic #semiconductors #bandwidth #engineers

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ATTENTION: If you care about the state of the U.S. printed circuit board (PCB) industry, can you spare five minutes to ask your U.S. Representative to support greater investments in cutting-edge, trusted PCB manufacturing? https://hubs.li/Q02SWxPS0 Congress is currently considering whether to adopt IPC-backed provisions that are in the Senate FY25 defense spending bill, S. 4921. The Senate’s bill includes a $45 million line item for PCB manufacturing investments, plus language encouraging the Secretary of Defense to prioritize investments in advanced PCB manufacturing going forward. IPC is calling on the House of Representatives to adopt the Senate’s strong language, which will boost the supply of trusted, cutting-edge PCBs used in virtually all defense technology. It is important that the House support this measure in any final package or else funding for PCB projects will fall to $0 in FY25. YOU CAN HELP! Send your Member of Congress a message, asking them to join in a letter to appropriators in support of these legislative provisions. Your message will help boost IPC’s advocacy to secure this funding and raise awareness of our industry’s critical role in the U.S. economy and national security. It will take only a few clicks, but it will make a difference. Thank you! https://hubs.li/Q02SWxPS0 #printedcircuitboards #PCBs #manufacturing #defense #nationalsecurity #technology

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MEMS Sensor Packaging and Testing Equipment Market Insights by Growth, Emerging Trends and Forecast by 2024-2033 https://lnkd.in/dEVipjWN The MEMS (Micro-Electro-Mechanical Systems) Sensor Packaging and Testing Equipment Market is experiencing significant growth due to the increasing adoption of MEMS sensors across various industries such as automotive, consumer electronics, healthcare, industrial, and aerospace. MEMS sensors are crucial for applications that require precise measurement and control, and their packaging and testing are critical to ensuring performance, reliability, and longevity. The market is driven by advancements in MEMS technology, increasing demand for smart devices, and the need for high-precision testing and reliable packaging solutions. Market Trends Miniaturization and Integration: The trend towards miniaturization and integration of sensors into smaller, more complex systems is driving the need for advanced packaging and testing solutions that can handle high-density configurations and ensure robust performance. Adoption of Advanced Packaging Techniques: Techniques such as System-in-Package (SiP) and Wafer-Level Packaging (WLP) are gaining traction. These methods improve the performance and reliability of MEMS sensors while reducing size and cost. Automated Testing Solutions: The use of automated testing equipment is increasing to enhance testing efficiency and accuracy. Automated systems can handle high volumes of sensors and provide precise measurements, critical for quality assurance in mass production. Emerging Applications in Healthcare: The healthcare industry is increasingly adopting MEMS sensors for applications such as wearable devices and medical diagnostics. This drives the need for specialized packaging and testing solutions that meet stringent healthcare standards. Market Drivers Growing Demand for Consumer Electronics: The proliferation of smartphones, wearable devices, and other consumer electronics is a major driver for the MEMS sensor market. These devices require reliable and high-performance sensors, boosting the demand for advanced packaging and testing solutions. Automotive Industry Growth: The automotive sector's push towards autonomous driving and advanced driver assistance systems (ADAS) relies heavily on MEMS sensors for functions like navigation, stability control, and collision avoidance, driving market growth. Industrial Automation and Industry 4.0: The trend towards industrial automation and smart manufacturing (Industry 4.0) is increasing the demand for MEMS sensors to enhance precision and control in industrial applications. Get Free Exclusive PDF Sample Copy of This Research Report https://lnkd.in/dunDU5MU Market Segmentations: Global MEMS Sensor Packaging and Testing Equipment Market: By Company KLA-Te

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Last chance to register for today's webinar! @Swagelok’s @Margaret Brennan explains how you can increase yield in your semiconductor wafer manufacturing process by optimizing the thermal loop system through proper component selection, installation, and performance testing. Register here — https://lnkd.in/efQwSZ8C #semiconductor #semiconductors #semiconductorindustry

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Did you see this Asian request for strategic partners? The topic of additive manufacturing using metal inkjet printing was discussed by Electroninks, Notion Systems, American Standard Systems and others at OUR UHDI Forum June 5 at PCB East. Elephantech announced at Taiwan's InnoveVex Startup Exhibition that it is seeking strategic partners to scale up manufacturing for rising demand of Printed Circuit Boards (PCBs) fabricated using metal inkjet printing. Masaaki Sugimoto, Co-founder and Board Director of Elephantech, joined the InnoVex Startup Exhibition in Taipei at the invitation of Epoch Foundation during Computex 2024, told DIGITIMES Asia, “We are looking for strategic partners who can help us build a stable supply chain together.” said Sugimoto. He explained that since the metal inkjet PCB is a very new process, Elephantech needs to collaborate tightly with other more experienced supply chain partners because it is difficult for itself to expand its capacity. Elephantech has signed an MOU with Liteon Technologies to introduce its additive manufacturing technology and collaborate in producing flexible PCBs. Its investors include Epson, Mitsui Chemical, Sumitomo, etc. Those strategic investors have been very helpful in building up Elephantech’s prototypes, proof-of-concept, and eventually manufacturing facilities and supply chain management system. #electronicpackaging #ICs #IEEE #IPC #SMTA #PCEA #microelectronics #printedcircuitboards #printedelectronics #hdipcb #electronicassembly #SMT #EMS #PCBAA #substrates #PCBAA #iMaps #SME #supplychain #EIPC #TPCA #OEMs #uspae #FPCs #AME #3Dprinting #mSAP #additivemanufacturing #HKPCA #JPCA #EIPC #supplychainmanagement #electronicsmanufacturing #chipsdontfloat #additivelymanufacturedelectronics #designengineers #advancedelectronics #microelectronics #supplychaincrisis. #nationalsecurity #emergingtechnologies #AME #3dprintingtechnology #PCBs #substrates #flexiblecircuits #FPC #pcbdesign #pcbengineering #PCBA #pcbfabrication #digitaltwin #leiterplatten #icsubstrates

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