Xin Tao

As modern chip designs heavily rely on SRAM, its density plays a critical role in the scaling of advanced nodes. According to the ISSCC 2025 Advance Program, the SRAM density of Intel Corporation's 18A (1.8nm-class) process aligns more closely with TSMC’s N3 than its N2 (2nm-class) process. ◾ Key Metrics: ▪️ Intel 18A: SRAM bit cell size of 0.021 µm², achieving ~31.8 Mb/mm². ▪️ TSMC N2: SRAM bit cell size of 0.0175 µm², achieving ~38 Mb/mm². ▪️ Comparison: Intel’s 18A SRAM density marks a notable improvement over Intel 4 (0.024 µm²) but doesn’t match TSMC’s aggressive N2 scaling. ◾ Notable Features: ▪️ Both nodes incorporate gate-all-around (GAA) transistors, yet TSMC has aggressively reduced SRAM sizes compared to its FinFET-based predecessors. ▪️ Intel 18A introduces a backside power delivery network (BSPDN), enhancing power efficiency and logic density potential. ◾ Bigger Picture: While SRAM density is vital, logic density often has a greater impact on overall scaling and performance. However, comparative logic density data for Intel 18A and TSMC N2 remain undisclosed. As SRAM scaling becomes increasingly challenging due to design complexities and variability at smaller nodes, the focus shifts toward balancing SRAM density, power consumption, and logic performance. What’s your take on the SRAM vs. logic density debate in advanced process technologies? Thanks again to Tom's Hardware for the full article with more background and insights click the source link in the comments below. #Semiconductors #Intel18A #TSMCN2 #SRAMDensity #ProcessTechnology #AdvancedNodes #ChipDesign #TechInnovation

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TSMC Advances Silicon Photonics Strategy: A Leap Towards Optical Era TSMC is making significant strides in silicon photonics, according to the Economic Daily News. Recent breakthroughs include integrating co-packaged optics (CPO) with advanced semiconductor packaging. Sample deliveries are projected for early 2025, with 1.6T optical transmission products expected in mass production by late 2025. Broadcom and NVIDIA are likely among the first customers. ◾ Key highlights include: ▪️ Successful trial production of the micro ring modulator (MRM) on TSMC's 3nm process, enabling CPO integration with HPC and AI ASIC chips. ▪️ Potential leap from electrical to optical signal transmission, addressing current limitations in speed and heat dissipation. ▪️ Challenges persist with CPO module packaging due to complexity and low yield rates, possibly leading to outsourced optical engine packaging. NVIDIA reportedly plans to adopt CPO for its GB300 chips (H2 2025) and Rubin architecture, aiming to enhance NVLink interconnect performance. These advancements position TSMC at the forefront of the optical computing era, reshaping the future of high-performance computing and AI applications. What are your thoughts on the potential impact of silicon photonics in AI and HPC? Share below! Thanks again to TrendForce Corporation for the full article with more background and insights click the source link in the comments below. #Semiconductors #SiliconPhotonics #AI #HPC #TSMC

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# "Samsung's 2nm Fabrication Technology: Advancing Semiconductor Innovation" Samsung's 2nm fabrication technology represents a major leap in semiconductor manufacturing, pushing the boundaries of transistor miniaturization. It is expected to leverage **Gate-All-Around FET (GAAFET)** technology, a significant shift from the FinFET architecture used in previous nodes. GAAFET offers better electrostatic control over the transistor channel, which results in higher performance and reduced power consumption. This technology enables more transistors to fit onto a single chip, leading to faster processing speeds, improved energy efficiency, and enhanced capabilities for applications like AI, 5G, and high-performance computing. Samsung aims to use this advanced node for cutting-edge devices, further driving innovation in areas like smartphones, data centers, and autonomous systems, while addressing the growing demand for more efficient, smaller, and powerful chips.

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‘Chip, Chip, Hooray’ engages Idaho youths in unique semiconductor class: https://lnkd.in/eJwNSX-F To prepare the next generation of semiconductor innovators, Boise State University and Idaho Digital Learning Alliance (IDLA) have launched a groundbreaking course—Chip, Chip, Hooray! —designed specifically for eighth to tenth-grade students across Idaho. The initiative is a collaboration between Boise State’s Institute for Microelectronics Education and Research (MER) and IDLA. As the first of three planned courses, it is part of a broader national initiative spurred by the CHIPS and Science Act of 2022, aimed at empowering young minds to engage in the cutting-edge industries of semiconductors and microelectronics. #semiconductor #manufacturing #technology #innovation #chips  #semiconductormanufacturing #advancedtechnology #engineering #lithography #nanometer #research #development #AI  #mobileprocessors #EUV #DUV

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Ampere announces 256-core 3nm #CPU, unveils partnership with Qualcomm 💡 Also looking at #chiplets, integration of third-party #IP Ampere Computing introduced its roadmap for the coming years, including new #CPUs and collaborations with third parties. In particular, the company said it would launch its all-new 256-core AmpereOne #processor next year, made on TSMC's N3 process #technology. Also, Ampere is teaming up with Qualcomm to build #AI inference #servers with the company's accelerators. Apparently, Huawei is also looking at integrating third-party UCIe-compatible #chiplets into its own platforms. Ampere has begun shipping 192-core AmpereOne processors with an eight-channel DDR5 memory subsystem it introduced a year ago. Later this year, the company plans to introduce 192-core AmpereOne CPUs with a 12-channel DDR5 memory subsystem, requiring a brand-new platform. Thanks again to Anton Shilov and Tom's Hardware for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/e6kMBR2Q #semiconductorindustry #semiconductors #semiconductor #tech #cpu #it #ic #semiconductormanufacturing #technology #chip #foundry #ai

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🌟 Elevate Your Semiconductor Team with Top Talent! 🌟 Are you in the semiconductor industry and seeking to strengthen your team with top-tier talent? Look no further! Our expert semiconductor direct hire recruiting services with NSOURCE at WGNSTAR are tailored to match your company's unique needs and propel your business to new heights. With a deep understanding of the intricacies of the semiconductor field, we specialize in identifying and attracting highly skilled professionals who possess the technical prowess and innovative mindset necessary to thrive in this dynamic industry. Here's why partnering with NSOURCE for your semiconductor direct hire needs is a game-changer: Industry Expertise: Our team comprises seasoned recruiters with a comprehensive understanding of the semiconductor landscape, enabling us to pinpoint candidates with the precise skills and experience you require. Extensive Network: Leveraging our vast network of industry connections and proprietary database, we access a pool of talent that may not be readily available through traditional channels, ensuring you have access to the best candidates in the market. Tailored Approach: We understand that every company has unique requirements and culture. That's why we take a personalized approach to recruitment, aligning our efforts with your specific goals and values to find candidates who not only possess the right skills but also fit seamlessly into your organization. Efficiency and Timeliness: Time is of the essence in the fast-paced semiconductor industry. Our streamlined recruitment process is designed to deliver results swiftly, allowing you to fill critical positions without delay and maintain your competitive edge. Long-Term Partnerships: We're not just here to fill a vacancy; we're committed to fostering long-term partnerships that drive your success. By understanding your strategic objectives, we can assist in building a robust team that propels your company toward its goals. Don't settle for mediocre talent when you can have the best. Let us be your trusted partner in semiconductor direct hire recruitment, and together, we'll take your team to the next level of excellence. Connect with us today to discuss how we can support your recruitment needs and empower your semiconductor business for sustained growth and innovation. Your success starts with the right people, and we're here to help you find them! #Recruiting #Hiring #NSOURCE #WGNSTAR #Semiconductor #Recruitment #DirectHire #TalentAcquisition #TechIndustry 🚀✨

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Cerebras files for IPO as it challenges Nvidia in AI chips https://lnkd.in/gCqZmNrJ Most people aren't familiar with Cerebras Cerebras Systems builds and sells the largest #AI "chip" in the world, each is the size of a full wafer - about 200 times larger than the largest NVIDIA chips

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Chip groups Arm and Qualcomm square off in high-stakes US trial https://lnkd.in/gByXgPD7 Arm and Qualcomm end up in court over the architecture license Arm granted to NUVIA Inc which was acquired by #qualcomm in 2021 while Qualcomm also has architecture license from ARM, and is claiming that given that it also has an architecture license, it didn't need ARM's explicit permission to acquire Nuvia's work, the devil is very likely in the details. It is almost certain that the type of "architecture license" #ARM gBe Nuvia isn't the same as the one given to Qualcomm. ARM would have retained certain IP rights to any changes made by Nuvia to the architecture/design, in Nuvia's license. Qualcomm etc. get a license where they keep what they do. the relief ARM is seeking - destruction of all that has been created is probably an unreasonable relief under a civil lawsuit, in civil suits court usually try to make reasonable amends for the aggrieved party with minimizing the disruptions to the other party and the society in general. As a result usually the standard enforcement is penal damages. Injunctions are called for in rare cases, for example if party A and party B are both selling some products that compete with each other, what B has no right to sell it without A's permission, and if B stops selling it, nobody in the world would be bothered too much. Even in such cases courts will encourage licensing settlements first. that's the nature of civil suits. But let's see how this case progresses. Trial is next week.

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Surging Demand for #Chip #Packaging #Equipment Driven by #AI Boom Global chip packaging equipment manufacturers are experiencing unprecedented #demand and soaring share prices, fueled by the rapid expansion of the #artificialintelligence industry. Key players in this surge include South Korea’s #Hanmi Semiconductor Co., Japan’s #Disco Corp., and the Netherlands’ #BE Semiconductor Industries N.V. (Besi). These companies are benefiting significantly as chip packaging – the process of encasing chips and connecting them to power and other components – gains importance. This shift comes amid challenges in advancing ultra-fine process technology to one nanometer or less, despite the rapid growth of AI, which necessitates faster chips. A prime example is #Nvidia Corp.’s H100 GPU chip, a global leader in AI chips, which achieves maximum performance through advanced packaging processes. “Some customers asked us to establish production lines and manufacture sufficient equipment, saying they would make payments in advance,” an official from a chip equipment maker remarked, highlighting the urgent and rising demand in the industry. Reference: https://lnkd.in/dWtYngWh

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As the growth chart for gallium nitride (GaN) wafer demand is looking more like a hockey stick, it’s apparent that innovators who have long believed in the merits of GaN are being proven right. A private company in El Segundo, CA that predates some of the other startups in the GaN-based power IC space by more than a decade has been hard at work developing solutions in this space for over seventeen years. That company is EPC - Efficient Power Conversion and I got a firsthand look at some of their solutions when I was at the 2024 APEC Conference. They were co-founded in 2007 by a luminary of the power IC industry and CEO Alex Lidow. Lidow was at International Rectifier for over thirty years and had leadership positions spanning R&D and manufacturing. He was even their CEO for 12 years. As co-inventor of the silicon power MOSFET in the 1970s, his seminal work has shaped development in this sector. Lidow was flanked by Joe Cao and Robert Beach, both of whom have also made their own impact. Cao had over 15 years of experience and more than 30 patents in developing GaN and silicon power device technologies before deciding to embark on the quest with Lidow. Beach had founded multiple companies aimed at bringing GaN ICs to the marketplace before partnering with Lidow and Cao, making him a perfect complement to their triumvirate. What put EPC on the map was the development of their proprietary enhancement-mode GaN (eGaN) transistors which they released in June 2009. Unlike traditional MOSFETs, which used built-in channels between the drain and source, eGaN MOSFETS had no such channel. eGaN MOSFETs’ have small geometry, low power dissipation, and are easy to manufacture, making them desirable for a wide array of applications. The founders also had the foresight to manufacture using a foundry meant to produce silicon devices and were able to create a mature, efficient, and low-cost supply chain to bring new products to market quickly. Nowadays, newer companies in the space are gaining similar traction using this approach, but it’s safe to say EPC was a pioneer and began to reap the benefits decades ahead of competitors. This is another key element that differentiates them. In my experience, “mature startups” tend to be modest organizations, often letting their technology speak for itself and not over-indexing on marketing their brands to potential talent. But the hiring landscape is far more competitive than it was when they started and the allure of high-growth startups can be attractive for talented engineers. EPC’s goal is to enable companies to develop their technologies by leveraging the power of GaN and avoid being left behind by developing on silicon. That, combined with their lengthy market presence and leadership team, are strong elements to highlight and EPC would be well-served to fold these details into their talent attraction messaging. #semiconductorindustry #galliumnitride #powermanagement

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🔎 Insights from AMD Meet the Experts with Rob Clark of Seekr Technologies 🤖 Here’s how AMD is driving AI innovation: 🎯 Two Key AI Workloads: 1️⃣ Training: High memory and bandwidth are critical for distributed training, scaling from single GPUs to thousands. 2️⃣ Inference: Efficient processing with large, fast memory ensures reduced latency and faster responses. 🎙️ Quote from Rob Clark: "From our experience, it’s really two sides: the training side—where high memory and bandwidth are critical for distributed training spanning GPUs—and inference, where efficient processing with large memory enhances performance and response time." 📈 What This Means: Train bigger models with more accuracy. Serve results faster by caching more data and reducing redundant operations. 🔗 Learn More: Watch the full webinar here: https://lnkd.in/gpCbgWgy #AMD #Seekr #AI #AMDBrandAmbassador #Instinct

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Tackling Data Retention in SSDs (by Anil Burra from Intelligent Memory) 🤩 "SSDs have conquered the market due to their speed, durability, energy efficiency, and small form factor. However, write endurance and data retention are concerns in #embedded and #industrial applications, especially as the technology moves to ever smaller nodes." (Anil Burra) With the scaling of #NAND #flash #technology to higher densities (e.g., Triple-Level-Cell or Quad Level-Cell) and smaller process nodes, data retention becomes more challenging due to increased cell-to-cell interference and reduced margins for charge storage. Therefore, newer #technologies may have shorter specified data retention periods compared to older, more robust #SLC (Single-Level-Cell) or #MLC (Mul ti-Level-Cell) #NAND products. Two key factors affect data retention, the period over which #flashmemory can store #data without loss or corruption, in #NANDflash cells: program/erase (P/E) cycling and operating temperature. A very big thank you to Anil Burra from Intelligent Memory for this insightful article via Electronic Specifier Ltd with more background and insights via the link below 💡🙏👇 - A very good read to an important TOPIC 🤩 https://lnkd.in/eqdH7-N2 #semiconductorindustry #semiconductormanufacturing #innovation #it #ai #ssd #datastorage #automotiveindustry #embeddedsystems #ic #computer #computing #iot #memory #chip #chips #technology #tech

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Tune into the Daily Semiconductor Industry Podcast for December 2nd, 2024! Hello, friends, followers, and listeners! I need your support. We pour a lot of time and effort into creating daily content for LinkedIn, and your engagement is what keeps us going. When you like, comment, and share our posts, it helps us reach a broader audience and grow this platform. Sharing truly is caring, and it allows shows like ours to connect with more industry professionals. Please take a moment to like, comment, repost, and share our content so we can continue delivering the latest updates and insights to the semiconductor community. Your support makes all the difference! ▪️Intel Corporation CEO Pat Gelsinger retires: Intel CEO Pat Gelsinger retired abruptly, with CFO David Zinsner and Michelle Johnston Holthaus named interim co-CEOs. Gelsinger's tenure was marked by aggressive restructuring, mass layoffs, and attempts to revitalize Intel's foundry business under its IDM 2.0 strategy. Despite progress in manufacturing, challenges in AI, market share, and delayed products persist. ▪️Samsung Electronics’s executive layoffs: Samsung reportedly cut over 100 senior executives from its semiconductor division, the largest in its history, sparking concerns about talent leakage to Chinese firms. China offers significantly higher salaries, raising fears of intellectual property risks. South Korea is striving to retain key talent through policy measures. ▪️EU's call for "Chips Act 2.0": SEMI Europe advocates for an expanded EU Chips Act to bolster the semiconductor ecosystem, align industrial policies, and counter US-China strategies. Recommendations include fast-track processes, supply chain incentives, and fostering foundational and green tech chips. We have some major updates in the semiconductor world, and we'd like to give a huge thank you to our sponsor,ventureLAB, for powering today’s industry review! ventureLAB is leading the way in helping startups in hardware and enterprise software thrive, playing a crucial role in advancing Canada’s semiconductor and AI ecosystems. #IntelLeadership #SemiconductorIndustry #TechLayoffs #ChipsAct #SemiconductorPolicy #TechTalent #InnovationInTech #SemiconductorEcosystem

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Attend 2024 TSMC Virtual Technical Talk: Exploring Diverse Paths in Semiconductor Technology If you are a student or professional looking to listen to industry legends(For free) talking about semiconductor Industry and careeers, we have got you covered. TSMC Is organizing a free Virtual Technical Talk to Explore Diverse Paths in Semiconductor Technology 🚀 Why Attend? Explore cutting-edge processes and technologies driving today’s digital revolution. Connect with industry pioneers and gain valuable insights into innovative solutions. Learn about advanced chip design and breakthrough manufacturing techniques. Get an inside look at the world’s largest semiconductor foundry. Opportunity to raise your questions to the experts. Date: Thursday, August 1 Time: 9 – 10:30 am (GMT+8) Registration link is in comments. For all semiconductor and AI related content, follow TechoVedas

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My reserach is pubulished in ACS Photonics as a cover article.

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