Bart Lemmen’s Post

Semiconductor manufacturer GlobalFoundries Inc. will invest $575 million in a new facility at its Malta campus with the help of new federal and state funding. The company announced Friday it will create the New York Advanced Packaging and Photonics Center, a secure facility to package, test, and manufacture semiconductors to support defense applications, AI and high-performance computing, among other industries. The new center is expected to create 100 new jobs in Saratoga County over the next five years. The facility will offer advanced packaging, assembly, and testing, allowing the company to more easily transform chips into individual packages ready for end-product use. The center’s new production capabilities are intended to help onshore advanced packaging, which mostly takes place in Asia today.

GlobalFoundries will create a center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by investments from the State of New York and the U.S. Department of Commerce, the center aims to enable semiconductors to be securely manufactured, processed, packaged, and tested entirely onshore to meet the growing demand for silicon photonics and other essential chips: #Photonics #Silicon #Chips

Well worth a look: Global IC Fabs And Facilities Report: 2024 from Elizabeth Allan Semiconductor Engineering. There's a table highlighting "more than 100 notable chip industry facility/fab investments", as well as commentary on JVs, understanding the supply chain, and updates on shutdowns and delays. #semiconductorindustry #waferfabs #ChipAct #semiconductormanufacturing

The first-of-its-kind New York Advanced Packaging and Photonics Center reinforces GF's commitment to secure and Trusted Foundry solutions, keeping chips for sensitive systems U.S.-based every step of the way. #innovation #nationalsecurity #technology #semiconductors https://lnkd.in/eU5trXt5

GF’s expanded advanced packaging capabilities in New York will deliver end-to-end solutions for essential chips powering AI, automotive, and other critical industries. This first-of-its-kind center marks a significant step forward for innovation in manufacturing. #innovation #manufacturing #technology #semiconductors

More exciting news for GF and the Capital Region!

The launch of GlobalFoundries' New York Advanced Packaging and Photonics Center is a significant step forward for the essential infrastructure of AI and other critical industries. #AdvancedPackaging and #SiliconPhotonics technologies are foundational for enabling the performance and efficiency breakthroughs that AI demands, particularly as workloads become more complex and energy-intensive. By addressing geodiversity in supply chains and prioritizing secure, power-efficient solutions, GlobalFoundries is directly tackling some of the most pressing challenges in scaling AI. These capabilities are critical for creating the semiconductors that drive data center efficiency, edge AI applications, and next-generation computational systems. GlobalFoundries’ partnerships at federal and state levels further underline the importance of bolstering the U.S. semiconductor ecosystem. Investments in innovation like this ensure the technological backbone of AI can continue to evolve and meet the demands of industries such as automotive, aerospace, and communications. These advancements don't just support AI—they enable its future. Congratulations to the team on this launch, which is a win not only for the semiconductor industry but for all sectors dependent on AI infrastructure. #CHIPS #Semiconductor #AI #Infrastructure #Investments #SupplyChain #PrivateEquity #TechLeadership AI Infrastructure Partners Bill Woodruff, CAIA Damon Pitler Justin Weinstein Jay Haladay Brian Brasch Corey Hoffman

🚫 Global Semiconductor Market Alert, as major projects grinding to a halt! #GlobalFoundries-#ST halts France project, and #SumitomoElectric freezes #SiC fab plans! 🤔 While postponing the German mega-fabs construction, Intel’s chip projects in Ohio have also been delayed. Construction is now pushed to 2026–2027, with operations expected to begin in 2027–2028. 💡More: https://buff.ly/40uFH1Y 🔗 #GlobalFoundries #ST #SiC #Intel #SumitomoElectric

The #semiconductor industry is grappling with uncertainty as several high-profile semiconductor #fab projects are struggling with delays, suspensions, or outright cancellations. Several major manufacturers, including Intel, Wolfspeed, SkyWater Technology, PSMC, GlobalFoundries and STMicroelectronics either halted construction or scaled back plans, raising concerns about supply chain stability and long-term market impact.

SK Hynix Plans to Spend $4 Billion on First US Chip Plant - SK Hynix Inc. plans to spend $3.87 billion building an advanced packaging plant and research center for artificial intelligence products in Indiana, marking a win for the Biden administration as it seeks to increase semiconductor output on American soil.  - The world’s No. 2 memory chipmaker said it will build its first US facility in the city of West Lafayette, with plans to begin mass production in the second half of 2028. The plant will center on a production line for next-generation high-bandwidth memory chips, critical components of the graphic processors that train AI systems. https://lnkd.in/esccrpTW