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Intel seeks foundry alliance with Samsung, says report (2 min read) Intel and Samsung Exploring a Strategic Alliance Intel CEO Pat Gelsinger has requested a meeting with Samsung Electronics’ chair, Lee Jae-yong, to discuss potential cooperation in the foundry sector. This partnership could enable the two companies to exchange manufacturing process technologies, share production facilities worldwide, and collaborate on R&D. The motivation behind the potential alliance is to counter the growing success of TSMC, especially at the 5nm and 3nm processing nodes, where both Intel and Samsung have struggled to compete. Reports indicate that Intel faces difficulties qualifying its latest 18A process, while Samsung has apologized publicly for underperforming in the foundry space. Facing Challenges, Intel and Samsung Consider a Bold Move Intel and Samsung have been losing ground to TSMC, which held 62.3% of the foundry market in Q2 2024, with Samsung trailing at 11.5%. Intel’s own foundry business has been inconsistent, and its delay in building fabs in Germany highlights financial strains. Samsung, though dominant in memory chips, has lagged in logic chip manufacturing. A potential Intel-Samsung foundry alliance could help both companies improve manufacturing economies of scale and regain competitiveness. The collaboration could even lead to Intel outsourcing its manufacturing operations, something speculated by industry observers. My Take An Intel-Samsung alliance could be a game-changer, but to catch up with TSMC, both companies need more than shared resources. They’ll have to demonstrate tangible technological improvements to win over skeptical customers. #IntelSamsungAlliance #Semiconductors #FoundryMarket #ChipManufacturing #TechIndustry #TSMC Link to article:          https://lnkd.in/dkT2fRHn Credit: eenews For more on AI, robots, and Semicon, check out my blog: https://lnkd.in/eWESid86

Intel is reportedly seeking a partnership with Samsung to counter TSMC's dominance in the semiconductor foundry market. Both companies aim to strengthen their positions and compete more effectively against the industry leader. While the specific details of the collaboration are unclear, potential areas of cooperation include research and development, production facilities, and process technology. This alliance could significantly impact the semiconductor industry landscape. #Intel #Samsung #TSMC #TechGiants #Foundries #Chips #Ssemiconductor #Semiconductors #SemiconductorManufacturing #SemiconductorIndustry #technology #technologynews #collaboration #competition #innovation #business #tech

𝗟𝗲𝘁'𝘀 𝗨𝗻𝗱𝗲𝗿𝘀𝘁𝗮𝗻𝗱 𝘁𝗵𝗲 𝗜𝗻𝘁𝗲𝗹-𝗦𝗮𝗺𝘀𝘂𝗻𝗴 𝗗𝗲𝗮𝗹: • Recently, there was news that Qualcomm would be acquiring the foundry business of Intel, but this deal has been postponed until after the completion of the US elections. • Intel Corporation and Samsung Semiconductor are reportedly discussing forming a 'Foundry Alliance' to compete against TSMC . • Both companies have struggled with customer acquisition, heating issues, and producing 3nm chips. However, this alliance might improve their situation, as they both have expertise in different sectors. • On the other hand, Arm has given Qualcomm a 60-day notice, allowing Qualcomm to continue designing chips based on ARM architecture. • It's worth noting that ARM is backed by SoftBank Group Corp. Group, which is also trying to develop its own AI chips. Source : Mint , ThePrint , Business Today 𝗧𝗼 𝗯𝗲 𝗰𝗼𝗻𝘁𝗶𝗻𝘂𝗲𝗱... #tech #semiconductors #foundry #intel #samsung #qualcomm #tsmc #AI #techdeals #semiconductorindustry

#intel + #samsung foundry. Pros and cons. Pro: - Samsung is ahead of Intel in some areas of foundry and Intel in others. - Both are losing to #tsmc so it makes sense to combine forces. - Intel needs to get rid of the capex intense foundry similar to what AMD did with GloFo. Con: - Intel as a whole is in trouble, falling behind against competitors rapidly with no sign of improvement (even though the marketing is in overdrive). - Intel foundry specifically is internally serving mostly internal customers. Where was the stick to beat when things were declining? Foundry cannot be a department, it needs a shark in charge to squeeze the last bit out of it. - Sasmsung as a whole apologized but foundry specifically saw major players move whole or partly from Samsung to TSMC. Yield is a complex issue and Samsung foundry has more than just yield issues. Same issue as with Intel, as a part of the Samsung brand, who is pushing for excellence and who gets booted when things go bad? And who can right the wrongs? - TSMC has its sole focus on foundry, if foundry fails, they are all out of business. They chose the right leadership to get the job done. Of course we will have to see, but AMD spun out foundry but was for years hampered by GloFo because of the requirement to manufacture with them. It was only when GloFo failed to get 7nm working that AMD forced its way out of the most important manufacturing (the compute dies) while they kept GloFo pad ring stuff. https://lnkd.in/gYBX-uvS

New Battleground for #TSMC, #Samsung & #Intel in Panel-Level Packaging According to a recent report by Nikkei, #TSMC is rumored to be entering the fan-out panel-level packaging (#FOPLP) industry, as indicated by insider sources. Additionally, UDN reported that Intel and Samsung have announced their intentions to invest in this sector. With #TSMC, a leading wafer foundry, joining the fray, these three major semiconductor companies are set to compete in the #FOPLP market. TSMC disclosed yesterday that it is closely monitoring advancements and developments in packaging technologies, with a particular emphasis on panel-level approaches. Nikkei emphasized that, in response to anticipated AI demand trends, TSMC is collaborating with equipment and material suppliers to develop innovative chip packaging techniques. This new technology utilizes a rectangular substrate for packaging, replacing the conventional circular wafer format. This change enables the accommodation of more chipsets on a single substrate. Although TSMC's research is in the early stages and may take several years to reach commersialization, it represents a significant technological advancement. Check full insights via the link below https://lnkd.in/gvDUEE7c

Intel's recent discussions with Samsung about potential cooperation in their foundry businesses indicate a shift in strategy. Despite significant investments in their 18A process, Intel seems uncertain about its ability to achieve industry-leading process technology by the end of next year. This uncertainty has likely prompted them to explore partnerships with other industry players. Both Intel and Samsung have been racing to develop 2nm processes incorporating GAA transistors and backside power delivery, aiming to surpass TSMC. However, Samsung has encountered challenges in achieving commercially viable yields, leading to delays in production equipment orders and customer acquisition. Intel, on the other hand, has made significant investments in advanced lithography technology, potentially offering valuable process expertise to Samsung. A potential Intel-Samsung foundry collaboration would have minimal impact on TSMC's dominant market position. TSMC's strong market share, particularly at advanced nodes, coupled with Samsung's relatively small market share and Intel Foundry's nascent presence, make it unlikely that the partnership would significantly disrupt the industry landscape. #Intel #Samsung #TSMC #TechGiants #Foundry #Foundries #Chips #Ssemiconductor #Semiconductors #SemiconductorManufacturing #SemiconductorIndustry #GAA #ProcessTechnology #technology #technologynews #collaboration #competition #innovation #business #tech #MarketShare #IndustryTrends

#NewsAlert Intel Expected to Split Foundry and Design Divisions Amid Strategic Shift  In a major shake-up, Intel Corporation is reportedly planning to separate its Foundry Services and Chip Design Operations into two distinct units. This anticipated move underscores Intel’s commitment to transforming its business model and meeting the diverse demands of the semiconductor market. The restructuring aligns with Intel’s goal to position its Foundry Services (IFS) as a leading provider of chip manufacturing for external customers, a space currently dominated by TSMC and Samsung. At the same time, the chip design unit would continue to innovate, focusing solely on developing advanced processors and custom silicon for Intel’s internal and external clients. Read More - https://lnkd.in/gPCm4Gsr #intel #channelnews #itVARnews #chipbusiness

TSMC has Kicked Off A Small-Scale Production Run Of 5,000 Monthly Wafers On The 2nm Process At Its Baoshan Plant TSMC has started small-scale 2nm wafer production at its Baoshan facility, achieving a reported 60% yield during trial runs. The company plans to ramp up production from 5,000 wafers per month to 80,000 by 2026 across its Baoshan and Kaohsiung plants, catering to customers like Apple, Qualcomm, and MediaTek. The advanced N2P variant is set for mass production in 2026, promising improved performance. Despite wafer costs soaring to $30,000, TSMC’s innovative ‘CyberShuttle’ service aims to lower client expenses by enabling chip evaluation on shared test wafers. This approach allows multiple companies to share a single wafer for design validation, significantly reducing costs by splitting the expense among participants and making advanced chip development more accessible and efficient. With no competition yet matching TSMC’s pace, the demand for its cutting-edge 2nm technology will remain robust. My Take TSMC’s focus on cost-reduction strategies like CyberShuttle shows its customer focus and support of cost reduction. It offers clients advanced technology and economic value. For industry leaders, partnerships with TSMC provide a competitive edge in developing next-generation silicon. #Semiconductors #2nmTechnology #TSMC #Innovation #AIChips #ChipManufacturing #TechLeadership #AdvancedLithography #FutureOfTech Link to article: https://lnkd.in/eJuPKSSm Credit: Wccftech, Economic Daily News This post was enhanced with AI assistance, thoroughly reviewed, edited, and reflects my own thoughts. Get Ahead with the Latest Tech Insights!  Explore my searchable blog: https://lnkd.in/eWESid86

Based on BCG research the U.S. share of worldwide fab capacity will hit 14% in the next 8 years. This is up from 10% and is inclusive of the added capacity coming from the approval of the “Chips Act.” The most notable gain in the U.S. will come in leading-edge logic. Without the passage of the Chips Act estimates are that U.S. production would have dropped to 8%. Note: in 1990 the U.S held 37% of the manufacturing in semis. A stark decline as offshoring to largely Asia (China, Korea, Taiwan) saw the industry and almost the entire leading edge manufacturing of chips out of the U.S. So, the TLDR here is despite more than $50 Billion in funding, the Chips Act will only make a small impact as continued capacity expansion around the world will keep the vast majority of manufacturing in Asia with China and Korea making the biggest gains in memory and packaging. Despite market leading chip design (nvidia, AMD, Qualcomm, Intel etc.) in the U.S. and considerable spending from Intel, Samsung, TSMC, GlobalFoundries and Micron in the U.S. the market share growth will remain negligible but is heading in the right direction. The diversification is promising and definitely reduces risk associated with Taiwan. But, we are far from returning to leadership in the U.S. as it pertains to semiconductor manufacturing. #Semiconductors

The Semiconductor Value Chain: Powering the Digital Age This semiconductor value chain infographic reveals the intricate network of players driving one of the most critical industries of our time. The value chain spans from design and R&D to manufacturing and testing, with key components as follows: ❐ Fabless Chip Designers: Companies like NVIDIA, AMD, Qualcomm, and Apple focus on chip design while outsourcing production to foundries. ❐ Foundries: Industry leaders like TSMC, Samsung Electronics, and GlobalFoundries handle the manufacturing of chips for fabless designers. ❐ Testing & Packaging: Firms such as Teradyne, ASE Global, and Amkor Technology, Inc. ensure chips meet stringent performance and quality standards. ❐ Supplier Layer: Providing raw materials, components, and R&D tools, companies like ASML, Applied Materials, and Shin-Etsu are essential to the ecosystem. ❐ Integrated Device Manufacturers (IDMs): Vertically integrated giants like Intel Corporation, Samsung Electronics, and Micron Technology handle the entire process, from design to production. At The Center for Strategic Research in Critical Technologies (CSRCT), we recognize the global interdependence of this value chain and its role in enabling advancements in AI, 5G, automotive, and consumer technology. Securing this ecosystem is essential for innovation, national security, and economic resilience. #Semiconductors #Innovation #GlobalCollaboration #TechPolicy #CSRCT #SupplyChainResilience #Technology #Policy