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Imec and ASML Advance Semiconductor Technology with High-NA EUV Lithography Belgian research company imec and ASML have achieved successful testing of the next generation of chip production machines, utilizing High-NA EUV lithography to print circuits as small as current commercial standards in a single pass. This cutting-edge technology employs light beams with a higher numerical aperture (NA) to create smaller and more complex circuit structures on semiconductor wafers, ultimately leading to the production of faster, more powerful, and more energy-efficient chips. The implications of this achievement are profound, as it confirms the resolution capability of High-NA EUV lithography, propelling semiconductor technology into the "angstrom era" and facilitating further advancements in chip manufacturing. Intel has already procured the initial two High-NA systems, while a third is slated for delivery to TSMC this year. Notably, other industry giants such as Samsung Electronics, SK Hynix, and Micron have also placed orders for these cutting-edge machines. This technological breakthrough is pivotal for the ongoing miniaturization of logic and memory technologies, with Intel’s planned 2-nanometer chips referred to as 20A (1 nm = 10 A). Additionally, the High-NA systems are impacted by US export bans, including restrictions on China, mirroring the constraints on the chips themselves. # Thank you Luca Rossi for your submission!
