CXMT Achieves 80% DDR5 Yield, Eyes 90% by 2025 – Disrupting the DRAM Market 📊🚀 CXMT, China's leading #DRAM #manufacturer, has made significant progress in #DDR5 production, reaching an impressive 80% yield—a major leap from its initial 50% yield. With plans to achieve 90% by 2025, CXMT is poised to make waves in the global #DRAM market. The company’s wafer output is set to reach 300,000 wafers per month by 2025, matching the scale of #Micron and positioning #CXMT to directly challenge the industry’s giants. CXMT currently operates two fabs in #Hefei: 1️⃣ Fab 1 focuses on DDR4 with a 90% yield and a capacity of 100,000 wafers per month. 2️⃣ Fab 2, dedicated to DDR5, uses 17nm technology and produces 50,000 wafers per month. While CXMT is still behind #Samsung and #SKhynix, which manufacture DDR5 chips using the more advanced #12nm node, its progress is notable. The company’s ambitious expansion plans—including adding 50,000 wafers per month to Fab 2 by 2025—could shake up the DRAM market, particularly as it pushes further into HBM2 production for AI hardware. Market Implications and Disruption 💥📉 Increased Competition: As CXMT ramps up DDR5 production, its ability to scale quickly and achieve high yields could force price reductions in the DRAM market. Established players like Micron, Samsung, and SK hynix may need to adjust their strategies in response to this rising competition. Market Share Shifts: With its aggressive cost structure and rapidly growing capacity, CXMT could begin to capture a significant portion of the global DRAM market—particularly in China, where local production is a key priority. This could lead to a shift in market dominance, especially in the low-cost and high-volume segments. Impact on AI Hardware: CXMT's advancements in #HBM2 production are particularly important for the growing #AI #hardware #market. Companies like #Huawei rely on CXMT’s memory products for AI accelerators, such as the #Ascend910 series. If CXMT scales its HBM2 production successfully, it could become a critical player in the global AI hardware supply chain, reducing dependency on Western suppliers. Technological Innovation: As CXMT pushes forward with new technologies, including HBM2 for high-bandwidth applications, it could accelerate innovation in the DRAM and memory sectors, prompting other companies to innovate faster to stay competitive. Looking Ahead 🌍🔮 CXMT’s rapid growth in both DDR5 and HBM2 production signals a changing landscape in the DRAM and memory market. By 2025, with a wafer output matching industry leaders and a target yield of 90% for DDR5, CXMT could dramatically alter the market dynamics, forcing competitors to adapt to a more competitive environment. #CXMT #DRAM #DDR5 #HBM2 #Micron #Semiconductors #AIHardware #TechDisruption #MarketShift #Innovation #ChinaTech 🚀📈 https://lnkd.in/didj5Qcg
Nick Florous, Ph.D.’s Post
More Relevant Posts
-
📈 Chinese DRAM Giant CXMT Achieves Major DDR5 Milestone: 80% Yield, Aiming for 90% by 2025 🇨🇳💡 Amid fierce competition from global DRAM leaders like SK hynix and Samsung, CXMT, China’s top DRAM manufacturer, is making significant strides in DDR5 production. Despite initial rumors suggesting poor yield rates between 10-20%, recent reports indicate a remarkable leap to 80% yield! 🔥 According to sources like TechPowerUp and MyDrivers, CXMT’s progress is a key development in the global DRAM market. This 80% yield is a huge improvement from the 50% yield when production first began, with the company now targeting a 90% yield by 2025 📅. CXMT’s DRAM Production & Strategy 🏭🔧 Currently, CXMT operates two fabs in Hefei, China: 1️⃣ Fab 1: Focused on DDR4 production with 19nm process, achieving an impressive 90% yield. It has a monthly capacity of 100,000 wafers. 2️⃣ Fab 2: Dedicated to DDR5 production with 17nm technology, producing 50,000 wafers per month. However, this is still behind competitors like Samsung and SK hynix, which use the more advanced 12nm node for DDR5. ⚙️ Looking Ahead: Expansion & HBM Production Plans 🔮 CXMT is not stopping here. The company has ambitious goals for DDR5 and HBM production: 🔜 By 2025, CXMT plans to expand its Fab 2 with an additional 50,000 wafer capacity per month to ramp up DDR5 production. 🔜 HBM2 production is already underway, with customer sampling in progress. CXMT aims to enter low-volume production of HBM2 by mid-2025 🧠⚡. This marks a significant milestone for the Chinese DRAM giant, especially as HBM2 is crucial for the development of AI hardware, such as Huawei’s Ascend 910 accelerator. The HBM Milestone 🎯 While SK hynix and Samsung are already mass-producing HBM3 and HBM3E, CXMT’s HBM2 production is a critical step forward in its DRAM roadmap. Acquiring the necessary HBM2 production equipment in Q3 2024, including advanced packaging tools like TSV and KGSD, CXMT is poised to become a significant player in the AI hardware and high-performance memory space 🌟. Conclusion: A Strong Path Ahead 🚀 CXMT’s progress in DDR5 and HBM2 production demonstrates the company’s growing capabilities in the highly competitive DRAM market. With continued investment in technology and expansion plans, CXMT is on track to become a key player in AI-driven and high-performance computing applications 🌍💻. #CXMT #DDR5 #HBM2 #AIHardware #DRAM #Semiconductors #MemoryTech #TechInnovation #ChinaTech #AI #HighPerformanceComputing #MemoryManufacturing #GlobalTech #SemiconductorIndustry #TechTrends #HBM #Samsung #SKhynix #Huawei #TrendForce https://lnkd.in/ed7ZnRAV.
To view or add a comment, sign in
-
TSMC's A16 (1.6nm) technology node on track to be mass produced in 2H 2026: This will be available with Super Power Rail, TSMC's version of the backside power delivery approach detailed by Intel, and the node is to feature a further 8 to 10 percent speed improvement at the same power compared with N2, and an additional 7 to 10 chip density gain. #semiconductor #semiconductorindustry #tsmc #intel #samsung #imec #globalfoundries #smic #umc #innovation #ai #computerchips #machinelearning #broadcomm #transistor #cowos #skhynix #microntechnology #kioxia #nanya #toshiba #ymtc #yangtze #scaling #moore #manufacturing #production #fabrication #apple #nvidia #arm #amd #qualcomm #ibm #huawei #chip #chipdesign #chipmaker #memory #logic #cpu #processor #FEOL #BEOL #interconnects #dram #nand #3Dnand #nandflash #storage #asml #euv #lithography #zeiss #optics #reticle #photomask #anamorphic #metalorganic #photoresist #laser #trumpf #rapidus #esmc #ksmc #Korea #Japan #europe
To view or add a comment, sign in
-
Intel's upcoming 18A process, while offering significant advancements like GAA transistors and a BSPDN, faces challenges in SRAM density compared to TSMC's N2. While 18A has improved SRAM density over previous Intel nodes, it falls short of TSMC's N2. However, the overall impact on chip performance and power efficiency depends on various factors, including logic density and power consumption, which are yet to be fully disclosed by both companies. Both Intel and TSMC are pushing the boundaries of semiconductor technology, and the ultimate winner will depend on a combination of factors beyond just SRAM density. #Intel #TSMC #techgiants #foundries #chips #18A #N2 #GAA #BSPDN #semiconductor #semiconductors #semiconductorindustry #semiconductormanufacturing #innovation #technology #AI #artificialintelligence #hardware #memory #memorychips
To view or add a comment, sign in
-
📈 Leading semiconductor foundry TSMC is reportedly preparing to increase the prices of its 3nm and 5nm processes! 💥 Additionally, there are rumors that TSMC will also raise the price of CoWoS packaging due to the massive demand for AI chips from AMD and NVIDIA. 💡 Dive deeper into the anticipated price increase and the reasons behind it: https://buff.ly/3MhR0nH 🔗 #TSMC #semiconductor #3nm #5nm #CoWoS
To view or add a comment, sign in
-
TSMC's N2 process has a major advantage over Intel's 18A: SRAM density https://lnkd.in/gAJU3Cqz TSMC N2 will be the first time in nearly a decade that a node has far superior SRAM density that previous node. SRAM bitcell has resisted shrinking for more than a decade. from N12 to N7 it shrunk very little, from N7 to N5 even less and from N5 to N3 not at all (in fact SRAM density reduced) N2 is coming in with about 20% shrink in bitcell area vs N3, for oldtimers of Semiconductors this isn't a lot, but given how last decade has been, this is still phenomenal what is more, next node from TSMC will have CFETs, with P and N FETs stacked vertically. that'll improve density once more. The news mentions Intel Corporation but about that I would only say 18A should properly be compared against N3P of TSMC. Just because Intel's previous CEO decided to call a Ford Focus a Ferrari didn't make it so.
To view or add a comment, sign in
-
Apple Orders M5 Chips From TSMC Ahead of Late 2025 Production : https://lnkd.in/eVZyxXmR Apple has ordered M5 chips from TSMC as the company begins production development of its next-generation processor for future devices, claims a new Korean-language report by The Elec and MacRumors.com. The M5 series is expected to feature an enhanced ARM architecture and will reportedly be manufactured using TSMC's advanced 3-nanometer process technology. Apple's decision to forgo TSMC's more advanced 2nm process for the M5 chip is believed to be primarily due to cost considerations. Despite this, the M5 will feature significant advancements over the M4, notably through the adoption of TSMC's System on Integrated Chip (SoIC) technology. #semiconductor #manufacturing #technology #innovation #chips #semiconductormanufacturing #advancedtechnology #engineering #lithography #nanometer #research #development #AI #mobileprocessors #EUV #DUV
To view or add a comment, sign in
-
-
#HardwareSpeculation time again! This is it people, year 2025 will be the last year Intel Corporation has any chance to capture a big enough segment of the sub 3nm chip manufacturing market as they're the only chip production company that actually has ASML machines capable of producing chips at the 2-1nm production process in their most recent chip fab. The question is: will Intel be able to kick it into full production before TSMC does? #TSMC #Intel #Semiconductors #ChipManufacturing #Nanotechnology #TechIndustry #SemiconductorIndustry #TechInnovation #AdvancedTechnology #TechNews #Electronics #Manufacturing #FutureTech #IndustryInsights #TechnologyTrends #MarketLeadership #Innovation #HighTech #Microchips
To view or add a comment, sign in
-
Samsung Electronics made history by achieving the world's first successful mass production of 3nm foundry in Jun 2022. Meanwhile, TSMC is gearing up confident in its 2nm process, aiming to attract more customers than the 3nm process. Recent rumors about TSMC delaying its 2nm process are linked to the innovative "Gate-All-Around (GAA)" technology. This technology, pioneered by Samsung Electronics in the 3nm process, significantly reduces leakage current in transistors, boosting chip power efficiency. TSMC's Vice President highlighted the remarkable success, stating that the yield when implementing GAA has already hit 90% of the target. Surely these exciting advancements are shaping the future of semiconductor technology... #tsmc #samsung #techgiants #foundries #chips #chipmanufacturing #semiconductor #semiconductors #semiconductormanufacturing #semiconductorindustry #innovation #technology #technologynews
To view or add a comment, sign in
-
TSMC in 2025H1: 3nm production capacity 100% 5nm production capacity 101% TSMC is reinforcing its dominance in the semiconductor industry, achieving 100% utilization for its 5nm and 3nm processes, driven by strong demand from NVIDIA, Apple, and MediaTek. NVIDIA's push to ship 200,000 Blackwell B200 AI GPUs by the end of 2024 has led TSMC to prioritize 5nm production, while 3nm gains momentum. The upcoming launch of TSMC's Arizona facility will further expand capacity, strengthening its market lead. As competitors like Intel and Samsung face production challenges, TSMC's strategic decisions and efficiency position it to dominate the future semiconductor landscape. Semiconductor /drone broker: YM Innovation Technolgy (Shenzhen)Co.,Ltd Email: semibroker@foxmail.com chipspotbroker@gmail.com https://lnkd.in/g-rAJQU5
To view or add a comment, sign in
-
-
TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025 💡 In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, #TSMC also shared progress of its N2 node as part of its Symposiums 2024. The company's first 2nm-class fabrication node, and predominantly featuring gate-all-around transistors, according to TSMC #N2 has almost achieved its target performance and yield goals, which places it on track to enter high-volume manufacturing in the second half of 2025. TSMC states that 'N2 development is well on track and #N2P is next.' In particular, gate-all-around nanosheet devices currently achieve over 90% of their expected performance, whereas yields of 256 Mb #SRAM (32 MB) devices already exceeds 80%, depending on the batch. All of this for a node that is over a year away from mass production. Meanwhile, average yield of a 256 Mb SRAM was around 70% as of March, 2024, up from around 35% in April, 2023. Device performance has also been improving with higher frequencies being achieved while keeping power consumption in check. Thanks again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eHgpfX4k #semiconductormanufacturing #semiconductors #semiconductor #tech #technology #innovation #chip #chips #integratedcircuits #ic #foundry #taiwan #geopolitics #asml #thenetherlands #europe #euv #computer
To view or add a comment, sign in
-
More from this author
-
📊 Reciprocal Tariffs and the Rebalancing of Global Trade: Impacts, Exposures & Economic Implications
Nick Florous, Ph.D. 1d -
🔍 Q2 2025 Outlook: AI, Silicon, and the Strategic Realignment of Compute 🧠💾
Nick Florous, Ph.D. 4d -
🤖 The Global Race for Humanoid Robotics Supremacy: Tesla, China, and the $10 Trillion Dream
Nick Florous, Ph.D. 1w