TSMC's Arizona fab gets big boost from U.S. government

TSMC's upcoming earnings call will likely focus on its capacity expansion plans, particularly its Arizona fab and CoWoS advanced packaging. Recent reports indicate that 4nm production has commenced at the Arizona facility earlier than anticipated, with initial output serving U.S. customers. Meanwhile, TSMC is expanding its advanced node production in Taiwan, with new 2nm and 1.4nm fabs planned in Northern and Southern Taiwan. Furthermore, the company is set to increase its CoWoS packaging capacity in Southern Taiwan to meet the growing demand for high-performance computing and AI applications. #TSMC #Foundries #chips #chipmanufacturing #semiconductor #semiconductors #semiconductormanufacturing #technology #innovation #AI #HPC #supplychain #USA #Taiwan https://lnkd.in/ds44mq2w

TSMC's US plant unlikely to get latest chip tech before Taiwan, CEO says : https://lnkd.in/ecVFpdd5 TSMC's new U.S. plant is unlikely to get the most advanced chip technology before factories in Taiwan due to complex compliance issues, local construction regulations and various permitting requirements, the Taiwanese company's CEO said. Taiwan Semiconductor Manufacturing Co (TSMC) CEO and Chairman C.C. Wei said building the new factory in Arizona has taken at least twice as long as in Taiwan, in comments detailing specific challenges for the U.S. as it seeks to rebuild its domestic chip manufacturing sector. #semiconductor #manufacturing #technology #innovation #chips  #semiconductormanufacturing #advancedtechnology #engineering #lithography #nanometer #research #development #AI  #mobileprocessors #EUV #DUV

Semiconductor Industrial Breaking News 1. ST releases 40V industrial and automotive linear regulators that combine efficiency and flexibility. 2. According to reports, Micron will receive more than $6.1 billion in grant subsidies from the U.S. Department of Commerce to help pay for domestic factory projects in the United States. The subsidy has not yet been finalized and is expected to be announced next week. 3. Chongyue Quartz spent US$207.16 million to expand its new factory in Mazhouhou Industrial Park, Chiayi, Taiwan, which was completed on the 17th. Quartz products will be supplied to TSMC's wafer fab in Arizona, USA, and Japan's Kumamoto wafer fab. Future revenue is expected to reach US$276.22 million. 4. TSMC officially announced its financial report for Q1 2024. The consolidated revenue for Q1 was approximately US$18.22 billion, a year-on-year increase of 12.9% and a month-on-month decrease of 3.8%. Net profit after tax was approximately US$6.93 billion, a year-on-year increase of 8.9%. Q1 gross profit margin was 53.1%, the operating profit margin was 42%, and the net profit margin after tax was 38%. 5. Samsung has officially launched the Exynos 5400, the first 5G modem to support two-way satellite communications. 6. Intel announces the creation of the world's largest neuromorphic system. This large-scale neuromorphic system, codenamed Hala Point, was initially deployed at Sandia National Laboratories and uses Intel's Loihi 2 processor. It is designed to support future brain-inspired artificial intelligence (AI) research and address challenge from current AI efficiency and sustainability. 7. Intel has completed the assembly of the first commercial high-NA EUV lithography machine, preparing for the development of Intel's 14A process. 8. SK Hynix announced that it has recently signed a memorandum of understanding (MOU) with TSMC. The two parties will cooperate to produce the next generation HBM and improve the integration of logic and HBM through advanced packaging technology. 9. TSMC investor conference: AI dominates demand and the recovery process of the semiconductor market is not as good as expected. #Semiconductor #ST #industrial #automotive #Micron #UnitedStates #ChongyueQuartz #Taiwan #TSMC #wafer #Japan #Samsung #Exynos5400 #5G #satellite #communications #Intel #neuromorphicsystem #HalaPoint #Loihi2processor #artificialintelligence #AI #EUV #SKHynix #MOU #HBM #st #stmicroelectronics #TI #texasinstruments #renesas #intersil #powerintegrations #nuvoton #winbond #gigadevice

Taiwan Semiconductor Manufacturing Co. (TSMC) will begin construction of its 4th and 5th wafer fabs, P4 and P5, in Kaohsiung next year to expand production capabilities. These facilities will emphasize high-end processes as part of TSMC's strategy to establish five fabs in the area, creating around 8,000 jobs. P4 and P5 will be built next to the third fab, P3, with completion expected by 2027. TSMC assures compliance with environmental regulations, addressing local concerns. The first fab, P1, is set to start mass production using a 2 nanometer process by 2025, building on the 3nm process launched in 2022. The second fab, P2, will finish construction next year and will also use the 2nm process. P3's completion is projected for 2026, with potential for advanced technologies. Although the processes for P4 and P5 are not finalized, TSMC reports strong client interest in the 2nm process and is developing the A16 process, expected to enter mass production in early 2026. #Semiconductors #Taiwan Want more analysis of major developments in AI, semiconductors, and cloud computing in Asia? Subscribe now to the Cognitive Asia newsletter--free of charge--at Substack https://lnkd.in/g4s6bqfi https://lnkd.in/gXi_jCXH

TSMC’s Chips Act Award Finalized by US, With Funds Coming This Year : https://lnkd.in/edfTxvWX The White House finalized its Chips Act incentive awards for Taiwan Semiconductor Manufacturing Co. (TSMC), marking a major milestone for a program meant to bring semiconductor production back to US soil. TSMC will get $6.6 billion in grants as part of the contract, the U.S. Department of Commerce said in a statement Friday. Though the amount was disclosed earlier this year as part of a preliminary agreement, the deal is now legally binding — making it the first major Chips Act award to reach this stage. #semiconductor #manufacturing #technology #innovation #chips  #semiconductormanufacturing #advancedtechnology #engineering #lithography #nanometer #research #development #AI  #mobileprocessors #EUV #DUV

Taiwan Semiconductor Manufacturing Co. (TSMC) reported record Q4 2024 revenue of $26.88 billion, up 37% year-over-year, driven by booming AI chip demand. The Phoenix fab has entered high-volume production ahead of schedule, with a second facility set to open in 2028. Backed by a $6.6 billion CHIPS Act grant, TSMC is solidifying its U.S. presence while advancing cutting-edge 2- and 3-nanometer technologies for clients like Apple and Nvidia. Despite challenges from escalating U.S.-China trade tensions, TSMC continues to lead innovation in high-performance computing and AI. In light of TSMC’s success, do you think more global companies will invest in U.S.-based chip manufacturing facilities? #RealEstateNews #CommercialRealEstate #svndca #MarketUpdate #PhoenixArizona #Multifamily #Phoenix #CRE #TSMC #Semiconductors #AIChips #USManufacturing #TechExpansion #CHIPSAct #AI #SemiconductorIndustry #GlobalTrade

Chip Industry Week In Review (2 min read) Semiconductor Innovation Heats Up: Major Deals, AI-Driven Research, and Industry Advances Key Partnerships and U.S. Initiatives in Semiconductor Manufacturing Amkor and TSMC announced a major partnership to drive advanced packaging and testing services at Amkor’s new facility in Arizona. The deal will leverage TSMC’s cutting-edge packaging technologies like Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS). Meanwhile, President Biden signed a law to expedite semiconductor projects under the U.S. CHIPS Act, reducing environmental review requirements to speed up domestic production. The U.S. Department of Commerce also launched a $100 million competition to develop AI-driven solutions for sustainable semiconductor manufacturing, aiming to accelerate research and innovation in this field. New Research and Industry Innovations Shaping the Future The National Semiconductor Technology Center (NSTC) has opened membership to key stakeholders, offering opportunities to influence U.S. semiconductor research and development. The eBeam Initiative revealed growing optimism around photomask market growth, with expectations that 5nm will be achievable by 2031 without relying on EUV technology. The increasing adoption of chiplets also creates new challenges for design teams, as highlighted in a special report emphasizing the importance of understanding chiplet interactions. Alphawave Semi, in collaboration with TSMC, unveiled a 3nm UCIe die-to-die subsystem chiplet that delivers impressive bandwidth and data rates, pushing the boundaries of semiconductor innovation. My Take The semiconductor industry is at a pivotal moment, with collaboration and AI-driven solutions playing a critical role in driving innovation. As new technologies emerge, sustainable manufacturing and advanced design methodologies will maintain the momentum. #Semiconductors #CHIPSAct #AdvancedPackaging #Chiplets #AI #Innovation #TSMC #Technology #Sustainability #TechNews #USManufacturing #5nm Link to article: https://lnkd.in/e7xF4JfR Credit: Semiconductor Engineering For more on AI, robots, and Semicon, check out my blog: https://lnkd.in/eWESid86

#Rapidus and Japan's Bold Move Toward #2nm Chip Production The Japanese government is making a significant push to strengthen its domestic semiconductor industry. In fiscal 2025, it plans to invest approximately $1.29 billion in Rapidus, a key player in Japan's cutting-edge chip manufacturing sector. This investment is part of Japan’s broader strategy to secure leadership in advanced chip production, with Rapidus targeting mass production of 2nm chips by 2027. However, reaching this ambitious goal will require an investment of up to 5 trillion yen. With the global #semiconductor race intensifying, Japan's commitment to advancing its technology and infrastructure is a critical move to remain competitive in the rapidly evolving industry. Rapidus is set to receive its first ASML EUV lithography machine at New Chitose Airport in Hokkaido by mid-December 2024. This will mark the arrival of Japan’s first-ever EUV lithography equipment, a major milestone for the country’s high-tech manufacturing capabilities. However, as revealed by Rapidus executives, the machine being delivered is an earlier 0.33 NA model, not the more advanced 0.55 NA (High NA) model, of which fewer than 10 units exist globally. In addition to Rapidus, at least two other wafer fabs in Japan—Micron and TSMC’s subsidiary JASM—are also planning to introduce advanced EUV machines in the near future, signaling Japan’s commitment to boosting its semiconductor production and staying competitive in the global market. Semiconductor /drone broker: YM Innovation Technolgy (Shenzhen)Co.,Ltd Email: [email protected] [email protected]

TSMC's Arizona facility is showing promising results, with yields exceeding those of its Taiwanese counterparts. This is a significant milestone for the company and the US semiconductor industry. The higher-than-expected yields for the 4nm process node indicate that TSMC's advanced manufacturing capabilities are successfully transferring to its US operations. This development has the potential to bolster US technological competitiveness and reduce reliance on foreign chip suppliers. #TSMC #techgiants #foundry #foundries #Arizona #chips #chipmanufacturing #semiconductor #semiconductors #semiconductormanufacturing #semiconductorindustry #technology #innovation #supplychain #UStech #globalization #AI #ML #highperformancecomputing

Revolutionizing Chip Manufacturing: TSMC's Cutting-Edge 2nm Plant in Taiwan The semiconductor industry is buzzing with TSMC's announcement to begin construction of a state-of-the-art 2nm plant in Taiwan, slated to start operations in 2025. This marks a significant leap forward in chip manufacturing, potentially reshaping the future of technology. Key Highlights: 2nm Technology: A breakthrough in performance and energy efficiency, making chips smaller, faster, and more power-efficient. Investment in Innovation: TSMC's $20 billion investment underscores their commitment to driving next-gen technologies. Global Impact: The 2nm plant is expected to support industries like AI, 5G, and automotive, amplifying Taiwan's role in the global semiconductor supply chain. Target Timeline: The first batch of chips from the plant is projected to roll out in 2025, with full-scale production by 2027. As technology evolves, how do you think advancements like this will shape industries globally? Let’s discuss in the comments! 📢 Join our VLSI Connect News channel on Telegram: https://lnkd.in/gk4gyWvt 📰 Stay updated with VLSI Connect News on LinkedIn: https://lnkd.in/g5aYa3Cp 🔗 Explore more on our website: https://vlsiconnect.com/ 🎧 Listen to our Daily news on Spotify: https://lnkd.in/gUGv4GhP https://lnkd.in/gcMVfmZi